Molded Semiconductor Package Structure for Warpage-Stable Heat Dissipation
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Solution Overview
Problem
Current semiconductor packages face challenges in achieving enhanced structural stability, increased productivity, and improved thermal management, particularly in designs where semiconductor chips and substrates are horizontally spaced apart.
Innovation Solution
A semiconductor package design featuring a first substrate with a semiconductor chip and a second substrate horizontally spaced apart, where a molding layer surrounds both, exposing the top surface of the second substrate and allowing for easy heat dissipation while preventing substrate warpage, thereby enhancing structural and thermal stability and productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a semiconductor chip and substrate are horizontally spaced apart, then thermal stability is improved through heat dissipation, but structural stability deteriorates due to substrate warpage
Solution Approach 1:
A molding layer is introduced as an intermediary component between the semiconductor chip and the substrate. This molding layer fills the horizontal space between the chip and substrate, providing mechanical support that prevents substrate warpage while allowing thermal dissipation. The molding layer acts as a mediator that resolves the conflict between thermal management requirements and structural integrity.
Solution Approach 2:
The thickness of the molding layer is specifically controlled to be greater than the thickness of the semiconductor chip. This parameter change ensures that the molding layer provides sufficient structural support to prevent warpage while maintaining the horizontal spacing necessary for thermal dissipation. The specific dimensional relationship (molding layer thickness > chip thickness) optimizes both thermal and structural performance.
2Stability of the object's composition
If a molding layer surrounds the semiconductor chip and second substrate, then structural stability is improved, but manufacturing complexity increases
Solution Approach 1:
The molding layer serves multiple functions simultaneously: it provides structural support to prevent warpage, fills the horizontal space between components, and creates a protective enclosure. By merging these multiple functions into a single component, the design achieves enhanced structural stability without proportionally increasing manufacturing complexity. The molding layer is formed as an integrated part of the package structure.
Solution Approach 2:
The molding layer is designed as a multi-functional component that performs structural support, thermal management, and mechanical protection functions. This universal component approach allows a single element to address multiple requirements, reducing the need for additional separate components and thereby limiting the increase in manufacturing complexity while achieving enhanced structural stability.
3Productivity
If the molding layer exposes the top surface of the second substrate, then productivity is improved for mounting additional chips, but manufacturing precision requirements increase
Solution Approach 1:
The package structure is segmented to expose specific surfaces that require accessibility for subsequent manufacturing steps. The molding layer is designed to expose the top surface of the second substrate while enclosing other areas, creating distinct functional zones. This segmentation allows additional semiconductor chips to be mounted on the exposed substrate surface without requiring complete removal or modification of the molding layer, thereby maintaining productivity.
Solution Approach 2:
The molding layer exhibits different properties in different locations: it encloses and protects certain areas while leaving the top surface of the second substrate exposed. This local quality variation allows the package to maintain structural integrity where needed while providing accessible surfaces for additional chip mounting, balancing manufacturing precision requirements with productivity goals.
Data Source
AI summary
A semiconductor package including: a first substrate; a first semiconductor chip and a second substrate horizontally spaced apart from each other on the first substrate; and a molding layer on the first substrate, the first semiconductor chip and the second substrate, wherein a thickness of the first semiconductor chip is greater than a thickness of the second substrate, wherein the molding layer exposes a top surface of the second substrate, and wherein the second substrate has fiducial marks exposed on the top surface of the second substrate.