Molded Package Substrate With Solid Copper Pillars for Heat Dissipation
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Solution Overview
Problem
Existing embedded package substrates face challenges in heat dissipation and electrical performance due to limitations in processing large-diameter through holes and hollow conductive through holes, which affect the heat and electrical conductivity of high-frequency and high-speed electronic components.
Innovation Solution
A molding process is used to create a package substrate with a solid conductive copper pillar layer that connects upper and lower circuits, improving heat dissipation and electrical performance by using the superior heat dissipation of metal materials and reducing parasitic capacitance and inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal frame is used to embed components with through-hole positions, then heat dissipation performance is improved, but the through holes become hollow after electroplating and cannot form solid conductive pillars
Solution Approach 1:
The patent applies preliminary action by pre-filling the through holes with conductive material (such as copper powder or conductive paste) before electroplating. This preliminary filling ensures that after electroplating, solid conductive pillars are formed rather than hollow ones, solving the problem of insufficient structural support and electrical conductivity in traditional hollow through holes
Solution Approach 2:
The patent uses composite materials by combining different conductive materials in the through holes. The base material (copper powder or conductive paste) provides initial conductivity and fill, while the electroplated metal layer adds structural strength and enhanced conductivity, creating a composite conductive pillar that achieves both solidity and electrical performance
2Ease of manufacture
If large-diameter through holes are drilled after packaging, then through-hole processing is enabled, but the diameters exceed 200 um and hollow conductive through holes are formed
Solution Approach 1:
The patent performs preliminary action by preparing and filling the through holes with conductive material before the actual packaging process. This advance preparation ensures that even when large-diameter holes are drilled after packaging, the holes are already filled with conductive material, preventing the formation of hollow structures and ensuring solid conductive pillars are formed
Solution Approach 2:
The patent segments the through-hole formation process into multiple stages: first drilling the holes, then filling with conductive material, and finally electroplating. This segmentation allows each step to be optimized independently, ensuring that large-diameter holes can be processed while still achieving solid conductive pillars through the multi-step filling and plating process
3Ease of manufacture
If organic matrix materials are used for embedded packaging, then component embedding is achieved, but heat dissipation characteristics are limited
Solution Approach 1:
The patent uses composite materials by combining organic matrix materials with metal components. The organic matrix provides the embedding structure and insulation, while metal through holes filled with conductive material provide heat dissipation pathways. This composite structure achieves both the ease of component embedding provided by organic materials and the superior heat dissipation of metal pathways
Solution Approach 2:
The patent introduces metal through holes filled with conductive material as intermediaries between the organic matrix and heat dissipation requirements. These metal-filled through holes act as thermal conduits that transfer heat away from embedded components, mediating between the insulating organic matrix and the need for efficient heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation and electrical performance by connecting circuits through solid conductive copper pillars, addressing the limitations of traditional methods and meeting the needs of miniaturization and high-frequency, high-speed, high-power products.
Implementation Method 1
circuits on upper and lower surfaces of the encapsulation layer are connected through the solid conductive copper pillar layer
Implementation Method 2
using the superior heat dissipation performance of metal materials
Data Source
AI summary
A package substrate based on a molding process may include an encapsulation layer, a support frame located in the encapsulation layer, a base, a device located on an upper surface of the base, a copper boss located on a lower surface of the base, a conductive copper pillar layer penetrating the encapsulation layer in the height direction, and a first circuit layer and a second circuit layer over and under the encapsulation layer. The second circuit layer includes a second conductive circuit and a heat dissipation circuit, the first circuit layer and the second conductive circuit are connected conductively through the conductive copper pillar layer, the heat dissipation circuit is connected to one side of the device through the copper boss and the base, and the first circuit layer is connected to the other side of the device.