Self-Aligned 3D Features in Molded IC Panels
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Solution Overview
Problem
Current microfabrication and micromachining processes face challenges in forming precise three-dimensional features within molded panels for microelectromechanical systems and fluid ejection devices, particularly in aligning fluid communication channels with fluid ejection dies without damaging the dies during the formation process.
Innovation Solution
The process involves depositing a feature formation material in a desired pattern within a molded panel, forming the integrated circuit dies, and then removing the material to create self-aligned three-dimensional features like fluid communication channels, which are formed after the dies are molded, ensuring alignment and minimizing damage to the dies during micromachining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If three-dimensional features are formed by micromachining processes before molding, then manufacturing precision is improved, but the integrated circuit dies may be damaged during the process
Solution Approach 1:
The patent applies preliminary action by first molding the integrated circuit dies into the panel before forming the three-dimensional features. This sequence ensures the dies are securely positioned and protected during subsequent micromachining operations, eliminating die damage while maintaining alignment precision through self-alignment of features to the dies
Solution Approach 2:
The patent uses a feature formation material as an intermediary substance that is deposited in a desired pattern within the molded panel. This material serves as a protective and guiding medium during micromachining, allowing precise formation of three-dimensional features without direct contact or damage to the integrated circuit dies
2Object-affected harmful factors
If three-dimensional features are formed after molding, then die damage is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent performs the molding action preliminary to feature formation, creating a stable base structure that simplifies subsequent micromachining operations. The dies are already positioned and secured in the panel, providing reference points for self-aligned feature formation without requiring additional complex alignment mechanisms
Solution Approach 2:
The molded panel with positioned dies serves as its own alignment reference for forming three-dimensional features. The features self-align to the dies through the molding process geometry, eliminating the need for separate complex alignment procedures and reducing overall manufacturing complexity despite the sequential process steps
Data Source
AI summary
Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.