Molded Photosensitive Assembly for Dual Lens Camera Modules
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Solution Overview
Problem
Current dual lens camera modules face challenges in ensuring uniform imaging quality due to uncontrollable dimension and position parameters, leading to deviations in the optical axis alignment and increased thickness, which affects image synthesis and overall rigidity, and are prone to contamination from exposed circuit components.
Innovation Solution
A molded photosensitive assembly with a mold sealer that encloses a circuit board and photosensitive units, using lead wires and electronic elements, and incorporates a reinforcing layer to enhance strength and heat dissipation, while minimizing the module's size and preventing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If lens bases are individually mounted on the circuit board to connect with each other via the circuit board, then the dual lens camera module can be assembled, but the dimension and position parameters become uncontrollable, leading to optical axis deviation
Solution Approach 1:
The patent merges the lens bases into a single integrated lens base structure instead of mounting two separate lens bases on the circuit board. This integration ensures that the dimension and position parameters are controlled during the molding process rather than through assembly, thereby maintaining manufacturing precision while simplifying the overall structure.
Solution Approach 2:
The integrated lens base serves multiple functions: it supports both lenses, provides precise positioning, and acts as a structural element of the circuit board assembly. This multi-functionality eliminates the need for separate mounting components and ensures consistent optical axis alignment.
2Ease of manufacture
If the circuit board is used to connect lens bases, then electrical connections are established, but the overall rigidity of the dual lens camera module is reduced
Solution Approach 1:
The lens base is integrated with the circuit board into a single rigid structure, combining the electrical connection function with the mechanical support function. This integration enhances the overall rigidity of the dual lens camera module while maintaining all necessary electrical connections through the integrated circuit board design.
3Strength
If lens motor assemblies are wrapped within the supporting frame, then structural support is provided, but the module's size increases and contamination risk rises
Solution Approach 1:
The supporting frame is merged with the lens base into an integrated structure, eliminating the need for a separate supporting frame that would increase module size. The integrated design provides the necessary structural support while maintaining a compact form factor and reducing contamination risk by minimizing exposed surfaces.
4Ease of manufacture
If circuit components are exposed, then assembly is simplified, but contamination from dust and other particles increases
Solution Approach 1:
The circuit components are integrated into the lens base structure, which provides a protective enclosure. This integration simplifies assembly by reducing the number of separate components while simultaneously protecting the circuit components from dust and other contaminants through the enclosed design.
Data Source
AI summary
An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.