Molded Photosensitive Assembly for Camera Wire Protection
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Solution Overview
Problem
The conventional COB packaging process for camera modules is inefficient in reducing size and improving imaging quality due to deformation of wires during molding, leading to reduced electrical conductivity and increased defect rates from short-circuits and contamination.
Innovation Solution
A molded photosensitive assembly with a supporting member made of elastic or inflexible material that prevents the upper mold from directly pressing on wires, maintaining a safe distance and preventing deformation, while also sealing the photosensitive area to prevent contamination and damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the molding process is introduced to reduce camera module size and improve manufacturing precision, then the overall size is reduced and manufacturing errors are minimized, but the wires protrude from the photosensitive element surface and may be deformed by the upper mold during pressing
Solution Approach 1:
A supporting member is introduced as an intermediary component between the upper mold and the wires. This supporting member has a pressing surface that contacts the upper mold, while the wires are positioned on the supporting member's surface. The supporting member thus mediates the pressing force, preventing direct contact between the mold and wires, thereby avoiding wire deformation while maintaining the molding process benefits.
2Ease of manufacture
If the upper mold presses downward during molding to form the supporter, then the supporter is integrally formed on the circuit board, but the protruding wire may be pressed and deformed by the mold surface
Solution Approach 1:
The supporting member is prepared in advance with a specific surface structure designed to receive and protect the wires. The wires are then positioned on this pre-prepared surface before the molding process begins. This preliminary arrangement ensures that during the subsequent pressing operation, the wires are already in a protected position, preventing deformation while allowing the molding process to proceed.
3Reliability
If glue is filled between every two elements in the COB packaging process to ensure imaging quality, then the packaging is secured, but the size of the camera module cannot be effectively reduced and packaging efficiency is low
Solution Approach 1:
The supporting member integrates multiple functions into a single component: it provides mechanical support for the photosensitive element, serves as a platform for wire positioning and protection, and acts as a pressing surface for the upper mold. This consolidation eliminates the need for separate glue-filling operations between elements, thereby improving packaging efficiency while maintaining structural integrity and imaging quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces wire deformation, maintains electrical conductivity, and enhances imaging quality by preventing short-circuits and contamination, thereby improving the manufacturing efficiency and yield of camera modules.
Implementation Method 1
A molded photosensitive assembly with a supporting member made of elastic or inflexible material that prevents the upper mold from directly pressing on wires, maintaining a safe distance and preventing deformation
Implementation Method 2
sealing the photosensitive area to prevent contamination and damage
Data Source
AI summary
A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.