Molded Polymer Composite Filler Spacing for Thermal Conductivity
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Solution Overview
Problem
Existing molded bodies with fillers dispersed in polymers do not achieve optimal thermal conductivity while maintaining a low volume ratio of fillers, as the average shortest distance between fillers is typically greater than 30 nm, limiting their thermal conductivity.
Innovation Solution
A molded body with fillers dispersed in polymers, where the volume ratio of fillers is 25 vol % or less and the average shortest distance between fillers is 30 nm or less, achieved through precise control of filler dispersion using focused ion beam scanning electron microscopy (FIB-SEM) analysis, allowing for closer filler arrangement to form thermal conduction paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the volume ratio of fillers is reduced to maintain flexibility, then the thermal conductivity deteriorates due to increased average shortest distance between fillers
Solution Approach 1:
The patent applies parameter changes by precisely controlling the average shortest distance between fillers to be 30 nm or less and the filler volume ratio to be 25 vol % or less. This optimization of physical parameters enables the molded body to achieve both high thermal conductivity (2.9 W/m·K) and flexibility simultaneously, resolving the contradiction between thermal performance and adaptability.
2Ease of manufacture
If the average shortest distance between fillers is increased, then the manufacturing process becomes simpler, but the thermal conductivity is limited
Solution Approach 1:
The patent replaces conventional mechanical mixing methods with a specialized dispersion technique that achieves uniform filler distribution with average shortest distances of 30 nm or less. This substitution enables better thermal conductivity while maintaining manufacturing feasibility through controlled dispersion processes.
3Temperature
If the filler volume ratio is increased to improve thermal conductivity, then the flexibility deteriorates
Solution Approach 1:
The patent optimizes the filler volume ratio parameter to 25 vol % or less while controlling the average shortest distance between fillers to 30 nm or less. This parameter optimization achieves high thermal conductivity (2.9 W/m·K) without sacrificing flexibility, as the close spacing of fillers creates effective thermal conduction paths even at low volume ratios.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The molded body exhibits enhanced thermal conductivity up to 2.9 W/m·K in the thickness direction, balancing thermal performance with flexibility and maintaining a low filler volume, suitable for applications in electronic devices and image forming apparatuses.
Implementation Method 1
an average shortest distance between the fillers determined by three-dimensional analysis of the molded body with FIB-SEM is 30 nm or less... forming thermal conduction paths
Data Source
AI summary
A molded body includes: at least one polymer selected from the group consisting of resins and rubbers; and fillers dispersed in the polymer, in which the volume ratio of the fillers in the molded body is 25 vol % or less, and the average shortest distance between the fillers determined by three-dimensional analysis of the molded body with FIB-SEM is 30 nm or less.