Molded Polymer Pressure Sensor for Lithography-Free Manufacturing
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Solution Overview
Problem
Conventional pressure sensors require lithography, physical vapor deposition, expensive materials, clean room handling, and handling of small substrates, and face adhesion and temperature compensation challenges.
Innovation Solution
A pressure sensor with a molded polymer body, including a diaphragm and conductive structures, formed through injection molding, 3D printing, or machining, using electroless metal deposition and a Wheatstone bridge, minimizing the need for lithography and clean room handling, and utilizing cost-effective materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional lithography and physical vapor deposition techniques are used to manufacture pressure sensors, then measurement precision and reliability are improved, but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent replaces complex lithography and physical vapor deposition processes with a simpler injection molding process that uses a molded substrate containing pre-formed conductive traces. This substitution maintains the functional requirements for pressure sensing while dramatically simplifying the manufacturing process, eliminating the need for clean room facilities and specialized equipment.
Solution Approach 2:
The conductive traces and circuit patterns are pre-formed in the molded substrate before the sensor assembly process. This preliminary action of creating the conductive structure in advance allows for simpler subsequent assembly steps and eliminates the need for complex on-site fabrication processes.
2Reliability
If conventional materials and processes are used, then sensor performance is maintained, but manufacturing cost and material expense increase
Solution Approach 1:
The patent changes the material parameters by using a molded polymer substrate with integrated conductive traces instead of traditional semiconductor materials requiring vacuum deposition. This parameter change in material selection and structure achieves comparable sensor performance while significantly reducing material costs and manufacturing expenses.
Solution Approach 2:
The patent merges the substrate and conductive trace layers into a single molded component. This consolidation eliminates the need for separate material deposition steps and reduces the total number of manufacturing operations, thereby lowering overall production costs while maintaining functional reliability.
3Reliability
If conventional pressure sensor manufacturing is used, then adhesion and temperature compensation are achieved, but the process requires clean room handling and handling of small substrates
Solution Approach 1:
The patent replaces the need for clean room handling and precise substrate manipulation with an injection molding process that forms the complete sensor assembly in a single operation. This substitution eliminates the handling of small substrates and the requirement for controlled environment facilities, significantly improving ease of operation.
4Temperature
If self-temperature compensating gauges are used, then temperature stability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The molded substrate serves multiple functions simultaneously: it provides the structural support, contains the conductive traces for sensing, and incorporates temperature compensation characteristics through its material properties and geometric design. This multi-functionality eliminates the need for separate self-temperature compensating gauge components, reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a cost-effective, easily manufacturable pressure sensor that can withstand high temperatures and pressures without requiring self-temperature compensation, reducing manufacturing complexity and costs.
Implementation Method 1
Forming at least one conductive structure can include electrolessly depositing a metal on the body
Implementation Method 2
The piezoresistive element is disposed within the diaphragm for serving as the sensing device of the semiconductor piezoresistive sensor
Data Source
AI summary
A pressure sensor and method of making the same including a body supporting at least one conductive structure. The body can be an injection molded polymer body having a diaphragm on which at least a portion of the at least one conductive structure is supported. The diaphragm can include one or more stiffening structures. The thickness of the diaphragm and the stiffening structures can be selected to adapt the pressure sensor to a wide range of pressures.