Stacked Molded Power Modules With Vertical Press-Fit Interface
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The side-by-side arrangement of molded power semiconductor modules increases PCB size unnecessarily in applications where enhanced cooling is not required or cannot be accommodated, leading to higher system costs.
Innovation Solution
A stacked module arrangement where molded electronic modules are vertically connected via an interface, such as a press-fit connection, allowing for a more compact design without increasing PCB dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If side-by-side arrangement of molded modules is used, then enhanced cooling is achieved, but PCB size increases unnecessarily
Solution Approach 1:
The patent transitions from a two-dimensional side-by-side module arrangement to a three-dimensional stacked configuration. Multiple power semiconductor modules are arranged vertically one above another and electrically connected through vertical interconnections, thereby utilizing the z-dimension (height) instead of only the x-y plane. This dimensional change allows compact integration while maintaining electrical functionality and enables cooling from multiple directions including top and bottom surfaces.
2Temperature
If side-by-side arrangement of molded modules is used, then enhanced cooling is achieved, but system cost increases
Solution Approach 1:
The patent transitions from a two-dimensional side-by-side module arrangement to a three-dimensional stacked configuration. Multiple power semiconductor modules are arranged vertically one above another and electrically connected through vertical interconnections, thereby utilizing the z-dimension (height) instead of only the x-y plane. This dimensional change allows compact integration while maintaining electrical functionality and enables cooling from multiple directions including top and bottom surfaces.
3Area of stationary object
If stacked module arrangement is used, then PCB size is reduced, but electrical connection complexity increases
Solution Approach 1:
The patent combines multiple power semiconductor modules into a single stacked assembly where the modules are vertically integrated and electrically connected through shared interconnection structures. The modules share common substrates, heat sinks, and electrical pathways, merging what would otherwise be separate electrical systems into one unified connection architecture. This reduces the overall complexity compared to multiple independent side-by-side connections.
Solution Approach 2:
The patent transitions from a two-dimensional side-by-side module arrangement to a three-dimensional stacked configuration. Multiple power semiconductor modules are arranged vertically one above another and electrically connected through vertical interconnections, thereby utilizing the z-dimension (height) instead of only the x-y plane. This dimensional change allows compact integration while maintaining electrical functionality and enables cooling from multiple directions including top and bottom surfaces.
Data Source
AI summary
A stacked module arrangement includes: a first molded electronic module; a second molded electronic module; and an interface by which the first molded electronic module and the second molded electronic module are physically and electrically connected to one another in a stacked configuration. The first molded electronic module is a power electronic module having a maximum breakdown voltage of at least 40V and a maximum DC current of at least 10 A.