IC Package Structure With Molded RDL Reinforcement and EMI Shielding
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Solution Overview
Problem
Conventional IC packaging methods fail to effectively protect the redistribution layer (RDL) structure and chips from damage during assembly and electromagnetic interference (EMI), leading to reduced performance or render the chips useless.
Innovation Solution
A method and structure where a molding compound layer and an EMI shielding layer are sequentially applied to the outer surfaces of the chip and RDL structure, providing enhanced structural strength and EMI protection by forming multiple layers and incorporating recesses or through holes for improved coverage and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the molding compound layer is provided before the RDL structure, then the chip back side is protected, but the RDL structure outer surfaces are not effectively protected and are subjected to damage in subsequent assembling processes
Solution Approach 1:
The molding compound is applied to the chip back side first, establishing a protective foundation before the RDL structure is added. This preliminary protective layer ensures that subsequent assembly processes do not damage the chip substrate, while the RDL structure can then be configured on top without compromising structural integrity.
2Reliability
If no EMI protection structure is provided in the chip packaging, then the packaging process is simpler, but the chip is affected by electromagnetic interference and may be damaged or become useless
Solution Approach 1:
The patent incorporates conductive filler particles within the molding compound matrix to create a composite material with EMI shielding properties. This composite structure provides electromagnetic interference protection while maintaining the mechanical protective functions of the molding compound, resolving the contradiction between reliability and structural complexity.
3Strength
If multiple layers and EMI shielding structures are added to protect the chip and RDL structure, then structural strength and EMI protection are enhanced, but the packaging process becomes more complex
Solution Approach 1:
The molding compound serves multiple functions simultaneously: it provides mechanical protection to the chip back side, acts as a structural support layer, and when infused with conductive fillers, provides EMI shielding capability. This multi-functionality reduces the need for separate protective layers, thereby enhancing structural strength without proportionally increasing manufacturing complexity.
Data Source
AI summary
An integrated circuit (IC) package structure includes a chip, a redistribution layer (RDL) structure, a molding compound structure and an electromagnetic interference (EMI) shielding structure. The RDL structure is formed on the chip and electrically connected thereto. The molding compound layer is provided on outer surfaces of the chip and the RDL structure. The EMI shielding structure is provided on outer surfaces of the molding compound structure. The molding compound structure layer provided on outer surfaces of the chip and the RDL structure provide protection and reinforcement to multiple faces of the IC package structure; and the EMI shielding structure provided on outer surfaces of the molding compound structure provides EMI protection to multiple faces of the chip and the RDL structure. The IC package structure has upgraded structural strength, reliability and stability in use. A method of manufacturing the above IC package structure is also introduced.