Thermally Conductive Molded Resistor Sealing for Heat Dissipation
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Solution Overview
Problem
Existing cement resistors face challenges in effectively dissipating heat generated by the resistive element due to limitations in thermal conductivity of the cement material used for sealing.
Innovation Solution
Incorporating a molded resin with a base resin and a filler having higher thermal conductivity than the base resin, which is embedded around the resistor body part, and manufacturing the resistor by injecting a molten resin into a mold to form the molded resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If cement material is used to seal the resistive element, then the resistive element is sealed and protected, but the heat dissipation performance is insufficient due to low thermal conductivity
Solution Approach 1:
The patent uses a composite material consisting of resin as the base and ceramic particles as filler. The resin provides sealing and protection similar to cement, while the ceramic particles with high thermal conductivity enhance heat dissipation. This composite structure resolves the contradiction by combining materials with complementary properties to achieve both sealing reliability and improved thermal performance.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the sealing material by adding ceramic particles with high thermal conductivity to the resin matrix. This parameter modification transforms the sealing material from a thermally insulating cement to a thermally conductive composite, thereby improving heat dissipation while maintaining sealing functionality.
2Temperature
If a molded resin with filler is used instead of cement, then thermal conductivity is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The patent employs injection molding technology to manufacture the molded resin. The molten resin material is injected into a mold cavity under pressure, allowing the resin to fill the mold and form the desired shape around the resistive element. This hydraulic/pneumatic process automates the manufacturing of complex resin components, making the process efficient and scalable despite the complexity of the molded resin structure.
3Temperature
If the resistor body part is embedded in molded resin, then heat transfer distance is shortened and heat dissipation is improved, but the device structure becomes more complex
Solution Approach 1:
The patent merges the sealing function, structural support function, and heat dissipation function into a single molded resin component. The molded resin simultaneously seals the resistive element, provides mechanical support, and conducts heat away from the resistor body. This consolidation of multiple functions into one component reduces overall device complexity while achieving improved heat transfer efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation of the resistor by shortening the heat transfer distance and enhancing thermal conductivity, while maintaining a compact size and reducing material costs.
Implementation Method 1
the molded resin comprises a base resin and a filler having a higher thermal conductivity than the base resin
Data Source
AI summary
A resistor is composed of a resistor body part and a molded resin in which the resistor body part is embedded. The molded resin includes a base resin and a filler that is higher in thermal conductivity than the base resin.