Molded Support Substrate Assembly for Compact Die Stacking
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Solution Overview
Problem
Semiconductor die manufacturers face challenges in reducing the size of die packages while increasing processing power, as stacking multiple dies vertically increases the device's profile, requiring substantial thinning of individual dies to achieve compactness.
Innovation Solution
A semiconductor device assembly with a support substrate formed from a molded material, allowing for the stacking of multiple dies with an intermediary die encapsulated within the substrate, reducing overall size and protecting the die from physical damage, while maintaining electrical isolation and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple semiconductor dies are stacked vertically to increase processing power, then the functional capacity of the package is improved, but the vertical profile of the device increases
Solution Approach 1:
An intermediary die is encapsulated within the molded substrate, nested between the first and second dies. This nesting approach allows multiple functional dies to be integrated in a compact vertical arrangement without requiring each die to be excessively thin, thereby maintaining processing power while controlling the overall vertical profile.
Solution Approach 2:
The intermediary die is positioned in the vertical dimension between the first and second dies, utilizing the Z-axis space efficiently. This dimensional arrangement allows for increased functional capacity without proportionally increasing the footprint, as the additional die is integrated within the existing vertical envelope rather than requiring lateral expansion.
2Length of moving object
If the vertical profile is reduced by thinning individual dies, then the device becomes more compact, but the mechanical strength and reliability of the dies are compromised
Solution Approach 1:
A molded substrate acts as an intermediary structure that provides mechanical support and structural integrity to the stacked die assembly. This substrate serves as a reinforcing backbone that compensates for the reduced thickness of individual dies, allowing for a compact vertical profile while maintaining overall assembly strength and reliability.
Solution Approach 2:
The package employs a composite structure combining thin semiconductor dies with a molded substrate material. This composite approach allows the individual dies to be thin for compactness while the molded substrate provides the necessary mechanical strength and structural support, achieving both compactness and durability.
3Power
If multiple dies are stacked to increase functional capacity, then the processing power is improved, but the device complexity increases
Solution Approach 1:
The intermediary die is encapsulated within the molded substrate, merging multiple functional elements into a single integrated package. This consolidation approach increases processing power by combining multiple dies while managing complexity through unified encapsulation and integrated interconnect structures within the molded substrate.
Data Source
AI summary
Semiconductor device assemblies with molded support substrates and associated methods are disclosed herein. In one embodiment, a semiconductor device assembly includes a support substrate, a first semiconductor die embedded within the support substrate, a second semiconductor die coupled to the support substrate, and a third semiconductor die coupled to the support substrate. The assembly can also include a redistribution network formed on a first and/or second side of the support substrate, and a plurality of conductive contacts electrically coupled to at least one of the first, second or third semiconductor dies.