Method of forming a molded substrate electronic package and structure
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Solution Overview
Problem
The manufacturing of near chip scale packages with small area substrates is challenging due to their thin, fine pitch, and small size, making them difficult to produce consistently while meeting industry demands for more functionality in smaller devices, and existing methods are not cost-effective or efficient for alternative conductive interconnect structures.
Innovation Solution
A method involving a molded substrate with a conductive substrate having lands separated by grooves, filled with an insulating layer, and conductive patterns formed on the land surfaces, allowing for a thin profile and adaptable configuration for attachment to a next level of assembly, using electroplating for conductive pattern formation and partial substrate removal to expose bottom land surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional manufacturing methods are used for near chip scale packages, then traditional packaging can be achieved, but manufacturing consistency and productivity deteriorate due to thin, fine pitch, and small size requirements
Solution Approach 1:
The substrate is segmented into distinct lands separated by grooves, allowing each land to be independently formed and positioned. This segmentation enables precise control over the fine-pitch features while maintaining manufacturing consistency through a systematic formation process rather than attempting to manufacture the entire substrate as a single complex component.
Solution Approach 2:
The grooves are formed in the substrate before the lands are created, establishing a predetermined framework that guides subsequent land formation. This preliminary action ensures that the fine-pitch features are positioned accurately from the outset, improving manufacturing consistency without requiring complex post-processing adjustments.
2Area of moving object
If small area substrates are used to meet industry demands for smaller devices, then device size is reduced, but manufacturing difficulty increases due to thin profile and fine pitch requirements
Solution Approach 1:
By dividing the small area substrate into discrete lands separated by grooves, the fabrication process becomes more manageable. Each land can be formed using standard techniques, and the grooves provide natural separation that simplifies the overall manufacturing of the compact substrate structure.
Solution Approach 2:
The substrate exhibits local quality variations with conductive lands in specific regions and insulating grooves in between. This local differentiation allows each region to be optimized for its specific function, making the small area substrate easier to manufacture by applying appropriate techniques to each local area rather than treating the entire substrate uniformly.
3Adaptability or versatility
If traditional substrate structures are used, then conventional interconnection can be achieved, but adaptability for alternative conductive interconnect structures is limited
Solution Approach 1:
The substrate structure with lands and grooves serves multiple functions: it provides mechanical support, creates conductive interconnection paths, and allows for various attachment configurations. This universal design enables the same basic structure to accommodate different interconnect technologies and package styles, increasing adaptability without proportionally increasing complexity.
Solution Approach 2:
The substrate structure is designed to be adaptable to different configurations and requirements. The land and groove pattern can be adjusted to suit various interconnect structures, allowing the substrate to dynamically adapt to different manufacturing and application needs rather than being fixed to a single configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the formation of conductive circuit patterns, enables fine-pitch implementations, reduces manufacturing costs, and facilitates the use of lands as output pads, enhancing the attachment of semiconductor packages to printed circuit boards while maintaining a reduced package thickness.
Implementation Method 1
An insulating material is disposed along sidewall surfaces of each land
Implementation Method 2
using electroplating for conductive pattern formation
Data Source
AI summary
An electronic package includes a substrate having a plurality of lands embedded within an insulating layer. Conductive patterns are disposed on at least a portion of a respective land top surface. An electronic device is electrically connected to the conductive patterns, wherein the land bottom surfaces are exposed to the outside. In another embodiment, the top land surfaces and the top surface of the insulating layer are substantially co-planar and the conductive patterns further overlap portions of the top surface of the insulating layer. In one embodiment, a package body encapsulates the top surface of the insulating material and the electronic device, wherein the land bottom surfaces are exposed to the outside of the package body.