Molded Support Substrate Assembly for Compact Multi-Die Stacking
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Solution Overview
Problem
Semiconductor die manufacturers face challenges in reducing the size of die packages while increasing functional capacity, as stacking multiple dies vertically increases the device's profile, requiring substantial thinning of individual dies to maintain compactness.
Innovation Solution
A semiconductor device assembly is developed with a support substrate formed from a molded material, allowing for the stacking of multiple dies while embedding intermediary dies within the substrate to reduce overall size and protect them from physical damage, using redistribution networks and interconnects for electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple semiconductor dies are stacked vertically to increase functional capacity, then the processing power is improved, but the vertical profile increases requiring substantial thinning of individual dies
Solution Approach 1:
Intermediary dies are embedded within the molded substrate, nesting them inside the package structure rather than stacking them vertically on the surface. This allows multiple dies to be contained within the same footprint volume, increasing functional capacity without proportionally increasing the vertical profile.
Solution Approach 2:
The patent transitions from traditional vertical stacking (z-dimension) to embedding dies within the substrate plane (x-y dimensions). By placing intermediary dies inside the molded substrate rather than stacking them vertically, the design utilizes internal three-dimensional space more efficiently, reducing the need for extreme die thinning.
2Area of stationary object
If the size of die packages is reduced to fit space constraints, then the footprint is improved, but the functional capacity decreases
Solution Approach 1:
Intermediary dies are nested within the molded substrate, allowing additional functional capacity to be contained within the same package footprint. This nesting approach enables more dies to be accommodated in a compact arrangement, increasing functional capacity without expanding the external dimensions.
Solution Approach 2:
The patent combines multiple functional elements (active dies, intermediary dies, redistribution networks, and molded substrate) into a single integrated package structure. By merging these components into one compact assembly with embedded intermediaries, the design achieves high functional capacity within a reduced footprint.
3Strength
If intermediary dies are embedded within the molded substrate, then mechanical protection is improved, but manufacturing complexity increases
Solution Approach 1:
Intermediary dies are embedded within the molded substrate during the molding process itself, rather than adding them in subsequent assembly steps. This preliminary action integrates the protection function into the base manufacturing process, reducing the need for additional complex assembly operations.
Solution Approach 2:
The molded substrate serves multiple functions: it provides mechanical protection for embedded intermediary dies, acts as a structural support, enables electrical redistribution through integrated networks, and facilitates thermal management. This multi-functionality consolidates several components into one, reducing overall manufacturing complexity despite the advanced design.
Data Source
AI summary
Semiconductor device assemblies with support substrates and associated methods are disclosed herein. In one embodiment, a semiconductor device assembly includes a support substrate, a first semiconductor die embedded within the support substrate, a second semiconductor die coupled to the support substrate, and a third semiconductor die coupled to the support substrate. The assembly can also include a redistribution network formed on a first and/or second side of the support substrate, and a plurality of conductive contacts electrically coupled to at least one of the first, second or third semiconductor dies.