Molded Substrates With Metal Frames for Print Heads
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Solution Overview
Problem
Existing electronic technologies face challenges in creating substrates that can adhere to integrated circuitry in environments with liquid or moisture without leaching contaminants, withstand curing temperatures, and maintain flatness and form factor, while also being cost-effective and recyclable.
Innovation Solution
The method involves using a metal frame with windows to mold substrates from thermoplastics, which allows for improved adhesion and reliability, reduced manufacturing costs, and recyclability, by aligning molds with the metal frame and inserting thermoplastics to form substrates with integrated circuitry, and using break tabs for singulation without leaving metal residues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If substrates are made from traditional materials to adhere to integrated circuitry in liquid environments, then adhesion and reliability improve, but the substrates may leach contaminants or absorb liquid
Solution Approach 1:
The substrate is formed from molded thermoplastic material that creates a composite structure with the metal frame. This composite approach allows the thermoplastic to provide chemical inertness and prevent leaching, while the molding process ensures proper adhesion to the integrated circuitry without requiring additional surface treatments.
2Temperature
If substrates are made to withstand curing temperatures and maintain flatness, then thermal stability improves, but manufacturing complexity increases
Solution Approach 1:
The substrate is molded in the metal frame before the integrated circuitry is attached. This preliminary molding action ensures the substrate is pre-formed with the correct flatness and dimensions, and can withstand subsequent curing temperatures without requiring complex post-processing or additional manufacturing steps.
3Ease of manufacture
If traditional molding methods are used without metal frames, then manufacturing simplicity improves, but substrate flatness and form factor control deteriorate
Solution Approach 1:
The metal frame acts as an intermediary structure during the molding process. It provides a rigid support that ensures the thermoplastic substrate is molded with precise flatness and form factor control. The frame serves as a mold cavity and support structure, enabling manufacturing precision without significantly complicating the overall process.
4Adaptability or versatility
If substrates are made recyclable, then environmental sustainability improves, but material selection and manufacturing options are limited
Solution Approach 1:
The substrate assembly is segmented into the metal frame and the thermoplastic substrate that can be singulated as separate components. The thermoplastic substrate can be molded and then separated using break tabs, allowing the substrate to be recyclable while maintaining manufacturing flexibility. This segmentation enables the substrate material to be chosen for recyclability without limiting the overall manufacturing options.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in cost-effective, reliable, and recyclable substrates that maintain adhesion and performance in liquid environments, reduce manufacturing complexity, and ensure compatibility with print liquids, while avoiding metal residues that could affect print liquid compatibility.
Implementation Method 1
molding material in the mold to produce a molded substrate
Implementation Method 2
molding material in the mold to produce a molded substrate
Data Source
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AI summary
Examples of molded substrates are described herein. In some examples, a molded substrate may support integrated circuitry. In some examples, the molded substrate and the integrated circuitry are included in a circuitry package for a replaceable print component. In some examples, the molded substrate is relatively flat. In some examples, molding remnants may be on the molded substrate.