Molded Thermometer Probe With Integrated Circuit and Positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic thermometers face challenges in ensuring accurate and repeatable temperature measurements due to the variability in positioning and contact of temperature sensors within the probe, leading to assembly failures and inconsistent results.
Innovation Solution
A molded plastic substrate with integrally formed positioning elements and a conductive circuit pattern directly on its surface, which securely positions temperature sensors and eliminates the need for additional wiring, providing reliable and consistent assembly and electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If components are mounted on a flexible substrate with adhesive, then the components can be positioned on the substrate, but the components may move before the adhesive sets, resulting in insufficient contact or incorrect positioning
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses and protrusions in the flexible substrate that guide and constrain component placement before adhesive application. These pre-formed positioning features ensure components are correctly positioned from the start, preventing movement during assembly and eliminating the need for adhesive to hold position during the critical initial setting phase.
Solution Approach 2:
The patent introduces positioning recesses and protrusions as intermediary structural elements between the flexible substrate and the electronic components. These intermediary features act as mechanical mediators that transfer and maintain precise positioning information from the substrate to the components, ensuring accurate alignment and contact without relying solely on adhesive bonding.
2Ease of operation
If a flexible substrate is bent into position during assembly, then the thermistor can be placed in position for contacting the probe tip covering, but the components may move or be positioned incorrectly due to substrate deformation
Solution Approach 1:
The patent applies preliminary action by pre-forming the flexible substrate with integrated recesses and protrusions in the correct three-dimensional configuration before assembly. This pre-shaping ensures that when the substrate is installed, the components are already positioned correctly relative to the probe tip covering, eliminating positioning errors that would result from bending the substrate during assembly.
Solution Approach 2:
The patent merges the positioning function and the structural support function into a single integrated flexible substrate design. The recesses and protrusions are formed directly in the substrate material, combining the substrate's structural role with the positioning role, thereby eliminating the need for separate positioning elements that would add complexity to the assembly process.
3Reliability
If additional wiring is used to connect electronic components, then electrical connections can be established, but the device complexity and assembly difficulty increase
Solution Approach 1:
The patent merges the electrical connection function with the mechanical substrate structure by forming conductive circuit patterns directly on the flexible substrate. This integration eliminates the need for separate wiring harnesses and connection elements, reducing device complexity while maintaining reliable electrical connections between components.
Solution Approach 2:
The flexible substrate serves multiple functions simultaneously: it provides mechanical support, establishes precise component positioning through recesses and protrusions, and creates electrical connections through integrated circuit patterns. This multi-functionality eliminates the need for separate wiring components, simplifying the overall device structure while ensuring reliable electrical connectivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability and repeatability of temperature measurements by ensuring accurate and consistent positioning of sensors, minimizing assembly failures, and improving the ease of assembly while maintaining thermal contact for precise temperature detection.
Implementation Method 1
a conductive circuit pattern formed directly on its surface electrically connects the sensing element to other electronic components of the medical device
Implementation Method 2
the patient's body heats the tip and the temperature sensor components sense the temperature of the tip
Data Source
AI summary
A medical measurement device, such as an electronic thermometer, having a probe. The probe includes a molded plastic substrate having a conductive circuit pattern formed directly on its surface. The circuit pattern extends at least from a first end margin of the molded plastic substrate to a second end margin opposite the first. The device also includes a sensor mounted on the molded plastic substrate for detecting a physiological parameter, such as temperature. The sensor is positioned on the molded plastic substrate at the first end margin by at least one positioning element integrally formed in the substrate. The conductive circuit pattern provides an electrical connection between the sensor and a processor.