Unitary Molded USB Device With SIP Module
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional USB storage device fabrication involves manual assembly steps, reducing throughput and increasing operating costs due to the need for inserting each System in Package (SIP) module into a housing, which hampers efficiency and scalability.
Innovation Solution
A unitary molded USB device is fabricated by molding multiple SIP modules together on a panel, then singulating them, and encasing each in a housing using injection molding, which reduces processing steps and enhances throughput while maintaining high reliability and portability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual assembly steps are used to insert each SIP module into a housing, then individual device assembly is achieved, but throughput is reduced and operating costs increase
Solution Approach 1:
Multiple SIP modules are molded together on a single panel in a batch processing operation, combining multiple assembly operations into one unified molding process. This eliminates the need for individual manual insertion of each SIP module into separate housings, thereby increasing throughput while maintaining manufacturing feasibility through economies of scale
Solution Approach 2:
The housing structure is pre-configured with recesses and engagement features that automatically position and secure multiple SIP modules during the molding process. This preliminary structuring of the housing allows SIP modules to be held in correct positions before molding, eliminating the need for manual positioning and insertion steps
2Productivity
If multiple SIP modules are molded together on a panel, then batch processing efficiency is improved, but device singulation and handling complexity increases
Solution Approach 1:
The panel of molded SIP modules is designed with pre-defined separation lines and structural features that allow clean singulation into individual devices. The housing structure includes features that facilitate easy separation of bonded modules, reducing the complexity of the singulation process despite the initial batch molding operation
Solution Approach 2:
The molded housing structure serves multiple functions: it protects individual SIP modules, provides structural integrity for batch processing, and incorporates features that enable both singulation and re-assembly. This multi-functional design simplifies the overall manufacturing process by eliminating the need for separate handling and protection steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves fabrication efficiency and reduces costs by enabling batch processing and economies of scale, while maintaining the reliability and portability of USB devices, and allows for easier insertion and protection of the SIP module within the housing.
Implementation Method 1
encasing each in a housing using injection molding
Data Source
AI summary
A USB device, and methods of forming same, are disclosed. The USB device includes a semiconductor device such as a SIP module and a housing injection molded around the semiconductor device.