Molding Apparatus Positional Displacement Control

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Solution Overview

Problem

During the curing process of resin-based molded products, the shrinkage caused by volume reduction leads to residual stress and decreased pattern accuracy due to positional displacement between the mold and the substrate table.

Innovation Solution

A molding apparatus with paired metal molds and a dual driving system, where the upper mold presses the resin and the lower mold is retained in a specific position before releasing the cured resin, ensuring minimal positional displacement by terminating the retention before mold release.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the substrate table is held in position during the entire curing process, then positional accuracy is maintained, but the curing reaction causes volume reduction and residual stress in the resin

Engineering Contradiction:
Improvepositional accuracyVSAvoidresidual stress
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The substrate table position is adjusted preliminarily before the curing reaction completes, based on predicted shrinkage amounts at different curing stages. This preliminary positioning compensates for the upcoming volume reduction, allowing the table to be released without causing residual stress while maintaining pattern accuracy.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system dynamically changes the positioning parameters (substrate table position) based on the curing reaction progress. By calculating and applying position corrections corresponding to different degrees of curing, the system adapts to the resin's volume changes without generating harmful residual stresses.

Inventive Principle:
Principle #35Parameter changes

2Object-generated harmful factors

If the substrate table is released early during curing, then residual stress is reduced, but positional displacement occurs between mold and substrate

Engineering Contradiction:
Improveresidual stressVSAvoidpattern accuracy
Core Design Contradiction:
Object-generated harmful factorsVSManufacturing precision

Solution Approach 1:

The substrate table position is preliminarily adjusted to account for expected shrinkage before release. This ensures that when the table is released, the mold and substrate remain properly aligned despite ongoing curing reactions, preventing positional displacement while allowing early release to reduce residual stress.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The system uses feedback from curing reaction monitoring to dynamically adjust substrate table positioning. By continuously assessing the curing state and calculating corresponding position corrections, the system maintains pattern accuracy even after table release during the curing process.

Inventive Principle:
Principle #23Feedback

3Manufacturing precision

If the substrate table is held for a long duration, then positioning accuracy is maintained, but heating occurs in the driving mechanism

Engineering Contradiction:
Improvepositioning accuracyVSAvoiddriving mechanism temperature
Core Design Contradiction:
Manufacturing precisionVSTemperature

Solution Approach 1:

The substrate table position is preliminarily set to account for curing shrinkage, enabling the table to be released earlier than traditional methods. This reduces the holding duration of the linear motor, thereby minimizing heat generation while maintaining positioning accuracy through predictive positioning adjustments.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach prevents positional displacement and residual stress, resulting in improved pattern accuracy and reduced load on the molding apparatus, enhancing the quality of the molded product.

Implementation Method 1

the molding target layer of the substrate is subjected to a curing reaction by applying thereto heat or light

Methodology Applied
Scientific EffectCuring reaction: Photopolymerisation

Implementation Method 2

a smaller electric current can flow through the substrate table moving means. This prevents heating from the substrate table moving means.

Methodology Applied
Scientific EffectLinear motor heating: Linear Motor

Data Source

PatentUS9987774B2Molding apparatus, molding apparatus unit, and molding method
Publication Date: 2018.06.05 SHARP KK
  • US9987774B2 patent drawing
  • US9987774B2 patent drawing
  • US9987774B2 patent drawing

AI summary

A molding apparatus (1) includes: a servomotor (11) for pressing a resin component (W) by moving an upper mold (MU) in a direction in which the upper mold (MU) is made close to a lower mold (ML); servomotors (12a and 13a) each of which retains X-coordinate and Y-coordinate positions of the lower mold (ML); and a position detection section (41) which determines whether or not the resin component which is sandwiched between the upper mold and the lower mold has been cured, the servomotors each terminating the retention of the lower mold when the resin component has been cured. This makes it possible to obtain a molded product while preventing positional displacement caused by a decrease in volume of a resin which is being cured.