Semiconductor Package Molding Compound Extended Portion Heat Dissipation
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Solution Overview
Problem
As electronic products are miniaturized, effective heat dissipation of high-power device dies in semiconductor packages becomes a critical issue, particularly in multi-die packages where the arrangement of dies and connecting elements affects the reliability of the packaged products.
Innovation Solution
A manufacturing method for semiconductor packages involves forming an adhesive layer with a patterned opening on a carrier substrate, placing high-power device dies on the adhesive layer with the opening serving as an alignment mark, surrounding the dies with a molding compound, forming a redistribution structure, and creating a heat dissipation module with a thermal interfacial layer and lid on the back side of the dies, which includes a body and extended portion of the molding compound for efficient heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high-power device dies are used in miniaturized electronic products, then power density and functionality are improved, but heat dissipation becomes more difficult and reliability deteriorates
Solution Approach 1:
The patent segments the heat dissipation function by introducing a dedicated heat dissipation module separate from the device die structure. The molding compound is divided into a body portion and an extended portion, where the extended portion specifically targets the heat dissipation need by protruding toward the heat dissipation module, creating a thermal pathway without interfering with the electrical functionality of the die.
Solution Approach 2:
The patent introduces a thermal interfacial layer as an intermediary between the device die and the heat dissipation module. This intermediary layer facilitates efficient thermal transfer from the die to the heat dissipation module, solving the heat dissipation problem while maintaining the integrity of both components. The molding compound's extended portion also acts as a thermal conductor bridging the die and heat dissipation module.
2Ease of manufacture
If dies are placed on adhesive layer without alignment marks, then manufacturing process is simpler, but positioning accuracy and reliability deteriorate
Solution Approach 1:
The patent applies preliminary action by forming alignment marks on the adhesive layer before placing the device dies. These alignment marks are created in advance during the adhesive layer formation process, enabling precise positioning of dies without requiring complex alignment procedures during die placement. This preliminary preparation resolves the contradiction by making the subsequent die placement both accurate and straightforward.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the positioning accuracy of dies, reduces misalignment, and enhances heat dissipation by forming a direct heat path at the back side of the dies, thereby increasing the reliability and efficiency of electronic devices.
Implementation Method 1
a heat dissipation module, comprising a thermal interfacial layer and a metal lid, wherein the thermal interfacial layer is in direct contact with the back side of the at least one device die, and located between the at least one device die and the metal lid
Data Source
AI summary
A semiconductor package and a manufacturing method of a semiconductor package are provided. The semiconductor package includes a device die, a redistribution structure, a heat dissipation module and a molding compound. The redistribution structure is disposed at a front side of the device die. The heat dissipation module includes a thermal interfacial layer and a metal lid. The thermal interfacial layer is in direct contact with a back side of the device die, and located between the device die and the metal lid. The molding compound is disposed between the redistribution structure and the heat dissipation module, and has a body portion and an extended portion. The device die is located in the extended portion. The body portion laterally surrounds the extended portion. The extended portion is thicker than the body portion.