Molding Compound Package with Electroplated Pillars
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Solution Overview
Problem
Conventional semiconductor packaging methods using fiberglass substrates are costly and prone to deformation, while those using molding compounds are rigid but easily crackable, making them unsuitable for fine pitch designs and multi-layered stacking structures.
Innovation Solution
A package apparatus utilizing a molding compound layer and a dielectric layer as core materials, with a Molded Interconnection System (MIS) and electroplating conductive pillars for electrical connections, replacing costly laser via hole formation processes with a simpler electroplating method.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If fiberglass substrate is used for packaging, then electrical characteristics and density can be improved, but manufacturing cost increases and substrate deformation occurs
Solution Approach 1:
The patent changes the material parameter from fiberglass substrate to molding compound substrate, maintaining the required electrical characteristics while significantly reducing manufacturing cost. The molding compound substrate achieves comparable electrical performance without the high cost and deformation issues of fiberglass substrates.
Solution Approach 2:
The patent employs a cost-effective molding compound substrate that replaces expensive fiberglass substrate. Although molding compound has different mechanical properties, it provides sufficient performance for the application at a much lower cost, making it an economically viable alternative.
2Reliability
If fiberglass substrate is used for packaging, then electrical characteristics can be improved, but substrate rigidity decreases and deformation occurs
Solution Approach 1:
The patent changes the substrate material parameter from fiberglass to molding compound, which has superior rigidity properties. The molding compound substrate maintains the required electrical characteristics while providing enhanced mechanical strength and resistance to deformation.
3Manufacturing precision
If laser via method is used for via hole formation, then via holes can be formed in fiberglass substrate, but processing complexity and manufacturing cost increase
Solution Approach 1:
The patent changes the substrate material parameter to molding compound, which enables simpler via hole formation methods. The molding compound substrate can be processed with less complex techniques compared to fiberglass, reducing manufacturing complexity while maintaining via hole precision.
4Reliability
If four-layered metal laminated structure is formed by repetition of laser via method, then electrical connections can be established, but manufacturing time and cost increase
Solution Approach 1:
The patent changes the substrate material to molding compound, which allows for more efficient processing of multi-layered metal structures. The molding compound substrate enables faster and less complex formation of electrical connections across multiple layers, significantly improving manufacturing efficiency while maintaining connection reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs and complexity, enhances substrate rigidity, and enables the production of thin-type stacking structures with improved reliability for high-density, small-pitch designs.
Implementation Method 1
electroplating conductive pillars for electrical connections
Data Source
AI summary
A package apparatus comprises a first wiring layer, a first dielectric material layer, a first conductive pillar layer, a first buffer layer, a second wiring layer, and a protection layer. The first wiring layer has a first surface and a second surface opposite to the first surface. The first dielectric material layer is disposed within partial zone of the first wiring layer. The first conductive pillar layer is disposed on the second surface of the first wiring layer. The first buffer layer is disposed within partial zone of the first conductive pillar layer. The second wiring layer is disposed on the first buffer layer and one end of the first conductive pillar layer. The protection layer is disposed on the first buffer layer and the second wiring layer.