Dielectric Molding Compound Waveguide for Millimeter-Wave Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current interconnect solutions for millimeter-wave frequencies face challenges such as high signal loss due to bond wires and PCB materials, and increased costs and size from integrating on-chip antennas, which are not efficient for high-speed and low-cost applications.
Innovation Solution
An embedded wafer level ball grid array (eWLB) package with a transceiver chip, dielectric molding compound, and antenna in the redistribution layer, where the molding compound acts as a dielectric waveguide, electromagnetically coupling the antenna to a plastic waveguide, minimizing signal loss by matching dielectric permittivity and eliminating the need for special PCB materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If bond wires and PCB materials are used for interconnect, then signal transmission is achieved, but signal loss increases
Solution Approach 1:
The patent extracts and eliminates the bond wires and PCB materials from the signal transmission path. By integrating the antenna directly into the redistribution layer and using the dielectric molding compound as the transmission medium, the harmful bond wires and lossy PCB materials are removed, thereby reducing signal loss while maintaining transmission quality
Solution Approach 2:
The patent changes the dielectric permittivity parameter of the molding compound to match that of the waveguide (within ±0.05 tolerance). This parameter matching minimizes impedance discontinuity and signal reflection at the interface, thereby reducing signal loss and improving transmission efficiency without compromising signal quality
2Reliability
If on-chip antennas are integrated, then signal transmission capability is improved, but cost and device size increase
Solution Approach 1:
The patent merges the antenna function with the redistribution layer by forming the antenna directly within the RDL structure. This integration eliminates the need for separate on-chip antenna components, reducing device size and manufacturing cost while maintaining full signal transmission capability at millimeter-wave frequencies
Solution Approach 2:
The redistribution layer serves multiple functions: it provides electrical interconnection and simultaneously hosts the antenna structure. The dielectric molding compound also serves dual purposes as both package encapsulant and waveguide medium. This multi-functionality reduces the number of components needed, thereby reducing device complexity and cost
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces signal loss and cost by integrating the antenna directly with the chip, using a dielectric molding compound with matched permittivity to the waveguide, enabling efficient millimeter-wave frequency transmission with reduced size and material requirements.
Implementation Method 1
the dielectric molding compound is configured to: form a transmission line interconnect comprising an antenna coupling surface and a transmission line coupling surface and electromagnetically couple the antenna coupling surface to the transmission line coupling surface
Implementation Method 2
The transmission line may have a first dielectric permittivity and the dielectric molding compound may have a second dielectric permittivity which matches the first dielectric permittivity to within a tolerance
Data Source
Figure 1
Figure 2~3
Figure 4
AI summary
One example discloses a transmission line interconnect, comprising: an antenna coupling surface; a transmission line coupling surface; and a dielectric molding compound electromagnetically coupling the antenna coupling surface to the transmission line coupling surface. Another example discloses a method of manufacture, for a transmission line interconnect, comprising: forming a dielectric molding compound; defining an antenna coupling surface on the dielectric molding compound; and defining a transmission line coupling surface on the dielectric molding compound whereby millimeter wave frequencies received at the antenna coupling surface are electromagnetically coupled to the transmission line coupling surface.