Molding Layer Package Structure for Lateral Heat Dissipation
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Solution Overview
Problem
New packaging technologies for semiconductor dies face manufacturing challenges, particularly in managing heat dissipation and thermal management due to the increased density and functionality of semiconductor devices.
Innovation Solution
A package structure with a molding layer containing high thermal conductivity fillers, such as graphite or diamond-like carbon particles, is used to encapsulate semiconductor dies and components, facilitating lateral heat dissipation and reducing operational temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor devices are scaled down with increased density and functionality, then production efficiency increases and costs decrease, but heat dissipation and thermal management become more difficult
Solution Approach 1:
The patent employs a molding compound comprising a base material and filler particles, where the filler particles have higher thermal conductivity than the base material. This composite structure enables enhanced heat dissipation capabilities while maintaining the protective encapsulation function, directly addressing the thermal management challenges arising from increased device density and scaling.
2Adaptability or versatility
If new packaging technologies are developed to improve density and functionality, then device integration increases, but manufacturing challenges arise
Solution Approach 1:
The patent modifies the thermal conductivity parameter of the molding compound by incorporating filler particles with specific thermal properties. This parameter change enables the material to meet the thermal management requirements of advanced packaging technologies while maintaining manufacturability through established molding processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the operational temperature of semiconductor devices by rapidly spreading heat generated by package components and dies, improving the performance and efficiency of the package structure.
Implementation Method 1
The molding layer includes fillers with high thermal conductivity, such as graphite or diamond-like carbon particles... rapidly spreading heat generated by package components and dies
Data Source
AI summary
A package structure and method for manufacturing the same are provided. A package structure is provided. The package structure includes a redistribution structure and a first package component and a second package component attached to the redistribution structure in a first direction and spaced apart from each other in a second direction. The package structure further includes an underfill formed around lower portions of the first package component and the second package component over the redistribution structure and a molding layer formed over the underfill and around upper portions of the first package component and the second package component. In addition, the molding layer includes a base material and fillers embedded in the base material. Furthermore, a thermal conductivity of the fillers is greater than about 400 W/mK.