Molding Material Packaging for Integrated Circuit Systems
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Solution Overview
Problem
Conventional multi-component or multi-chip system packaging is complex, costly, and prone to thermomechanical stress issues due to the use of materials with different thermal expansion coefficients, leading to mechanical reliability concerns and increased system size.
Innovation Solution
An integrated circuit system packaging method where devices are mounted on both sides of a molding material, with conductive layers connecting them through connection holes, allowing for increased device integration, reduced thermomechanical stress, and simplified production processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multi-component packaging is used with wire bonding or flip-chipping onto a substrate, then electrical connections can be established, but the amount of materials used increases, process complexity increases, and production cost increases
Solution Approach 1:
The patent merges the substrate function with the molding material by directly mounting devices onto the molding material without requiring a separate substrate. The molding material serves dual purposes: encapsulation and mechanical support, eliminating the need for wire bonding or flip-chipping processes and reducing material usage while maintaining electrical connection reliability through direct bonding techniques.
Solution Approach 2:
The patent extracts the substrate from the traditional packaging structure, allowing devices to be mounted directly on the molding material. This removal of the intermediate substrate simplifies the packaging structure, reduces the number of materials needed, and eliminates complex interconnection processes while maintaining reliable electrical connections.
2Reliability
If conventional packaging with multiple materials is used, then devices can be connected to circuit boards, but thermomechanical stress problems occur at material interfaces
Solution Approach 1:
The patent applies homogeneity by using the same molding material for both encapsulation and device mounting substrate. This single-material approach eliminates interfaces between different materials with different thermal expansion coefficients, thereby preventing thermomechanical stress problems while maintaining reliable device connections and circuit board interfacing.
3Adaptability or versatility
If more devices are integrated on the system, then stronger functions are achieved, but the overall volume and production complexity increase
Solution Approach 1:
The patent utilizes both sides of the molding material for device mounting, effectively doubling the device integration capacity within the same footprint. This two-sided mounting approach increases system functionality and device density without proportionally increasing the overall volume, as devices are distributed on opposite faces of the same encapsulant.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables high-density, high-performance integrated circuit systems with reduced warpage and production costs, maintaining ultra-thin and flexible characteristics, while improving mechanical reliability and production efficiency.
Implementation Method 1
a molding material is provided between the first carrier and the second carrier, the first device set and the second device set are respectively in contact with the molding material, and the molding material is cured such that the first device set and the second device set are respectively mounted at two sides of the molding material
Implementation Method 2
the first device set is mounted at the first carrier by a thermosensitive adhesive material, and in the detaching step, the thermosensitive adhesive material is heated or cooled to make the first carrier detached from the first device set
Data Source
AI summary
An integrated circuit system and a packaging method therefor are disclosed. The method includes providing a first carrier and a second carrier oppositely, with a first device set of the first carrier and a second device set of the second carrier both located between the first and second carriers, providing a molding material between the first and second carriers to make the first and second device sets respectively in contact with the molding material, curing the material to make the first and second device sets respectively mounted at two sides of the molding material, making the first and second carriers detached from the first device set and the molding material and from the second device set and the molding material respectively; and forming connection holes in the molding material and fabricating a conductive layer which extend into the connection holes to electrically connect the first and second device sets.