Molding Part Protection in Bendable Display Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increase in thickness of the molded part to absorb impact in the bending area of the display leads to an overall thickness increase of the electronic device, reducing the active area of the display and creating unnecessary space, and direct bonding of the bonding member to the molded part during reassembly can damage it.
Innovation Solution
The electronic device includes a housing, display, window cover, and molded part with a plate extending from the bending area, where the plate is disposed on the molded part to protect it from impact, reducing its thickness and preventing damage during reassembly by attaching a bonding member to the plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the thickness of the molded part is increased to absorb impact in the bending area of the display, then the impact resistance is improved, but the overall thickness of the electronic device increases
Solution Approach 1:
The patent introduces a separate plate structure positioned between the housing and the molded part, dividing the impact absorption function into two components: the plate provides initial impact resistance and the molded part provides additional cushioning. This segmentation allows the molded part to maintain reduced thickness while still achieving adequate impact protection through the combined system.
Solution Approach 2:
The plate acts as an intermediary element between the housing and the molded part, intercepting external impacts before they reach the molded part. This mediator structure reduces the burden on the molded part, allowing it to be thinner while the overall system maintains sufficient impact resistance through the plate's protective function.
2Strength
If the bonding member is attached directly to the lower portion of the molded part, then the bonding strength is improved, but the molded part may be damaged during reassembling process
Solution Approach 1:
The plate serves as an intermediary bonding surface between the housing and the molded part. The bonding member is attached to the plate rather than directly to the molded part, distributing bonding stresses and preventing direct mechanical damage to the molded part during reassembly operations while maintaining adequate bonding strength through the plate's structural support.
Solution Approach 2:
The plate provides beforehand protection to the molded part by absorbing and distributing bonding forces before they can directly affect the molded part's integrity. This prior cushioning effect prevents damage during the bonding process and subsequent reassembly operations while ensuring reliable attachment.
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
An electronic device according to an embodiment of the present disclosure may include a housing, a display including a bending area disposed at a distal end of the display and extending while being bent, the display having at least a part surrounded by the housing, a window cover disposed in one direction of the display, a plate including an extension area extending and spaced apart from the bending area of the display, the plate having at least a part disposed in the other direction that is a direction opposite to one direction of the display, and a molded part disposed in a space surrounded by the bending area of the display, the window cover, and the extension area of the plate.