Molding Photosensitive Assembly for Compact Camera Module
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Solution Overview
Problem
Conventional camera module packaging processes, such as COB, struggle to reduce size while maintaining imaging quality due to the need for larger photosensitive elements and passive electronic components, and are inefficient in terms of packaging efficiency and stain sensitivity.
Innovation Solution
A camera module with a molding photosensitive assembly that integrates a lens, photosensitive element, and circuit board using a molding base formed through a thermohardening process, reducing the distance from the lens to the photosensitive plane and creating an enclosed space to minimize stain sensitivity and improve packaging efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a COB packaging process is used to mount components sequentially on a circuit board, then the imaging quality can be ensured through proper component placement, but the camera module size cannot be effectively reduced and packaging efficiency remains relatively low
Solution Approach 1:
The patent combines the lens, photosensitive element, and circuit board into a single integrated assembly where the lens is directly mounted on the photosensitive element which is already mounted on the circuit board. This merging of multiple components into one assembly unit eliminates the need for separate mounting operations, thereby improving packaging efficiency while maintaining imaging quality through precise pre-alignment during assembly.
2Shape
If glue is filled between the bracket and circuit board to achieve leveling in COB packaging, then component alignment can be achieved, but the camera module size cannot be effectively reduced
Solution Approach 1:
The patent extracts and eliminates the bracket component from the traditional COB packaging structure. By directly mounting the lens on the photosensitive element which is already fixed to the circuit board, the patent removes the intermediate bracket and the associated glue-filled leveling process, thereby reducing overall camera module size while maintaining proper alignment through direct mounting geometry.
3Volume of moving object
If the distance from lens plane to photosensitive plane is reduced to make the camera module more compact, then the camera module size is reduced, but stain sensitivity increases
Solution Approach 1:
The patent implements a nested structure where the lens is positioned within a lens holder that is integrated with the photosensitive element assembly. The lens holder creates a protected enclosed space that shields the optical path from external contaminants. This nesting approach allows for reduced distance between lens and photosensitive element while maintaining compactness and reducing stain sensitivity through physical protection of the optical path.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the size of the camera module, enhances imaging quality, and lowers stain sensitivity, allowing for more compact and stable camera modules with improved product yield.
Implementation Method 1
The camera module and the lens of the molding photosensitive assembly are subjected to a thermohardening process and can withstand a high molding ambient temperature during a molding process
Data Source
AI summary
The present invention provides a camera module, a molding photosensitive assembly thereof, a manufacturing method, and an electronic device, the molding photosensitive assembly comprises a lens, a photosensitive element, a circuit board, a molding base, and a supporting element, the photosensitive element being arranged on the circuit board, the molding base being formed into an integral structure with the lens, the supporting element, the photosensitive element, and the circuit board by means of a molding process, and the camera module and the molding photosensitive assembly thereof being capable of reducing stain sensitivity and shortening the distance of the lens plane above a light through hole of the lens to the photosensitive plane of the photosensitive element.