Molding Resin Composition for High-k, Low-Loss AiP Packaging

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Solution Overview

Problem

The challenge is to develop a molding resin composition that achieves a high dielectric constant while maintaining a low dielectric loss tangent, particularly for antenna-in-packages (AiPs) where increased radio wave frequencies lead to transmission signal loss due to high dielectric loss tangents in existing materials.

Innovation Solution

A molding resin composition comprising an epoxy resin, a curing agent, and an inorganic filler with a specific combination of calcium titanate and strontium titanate particles, along with silica and alumina particles, which provides a high dielectric constant and suppresses dielectric loss tangent, optimized for use in high-frequency devices and AiPs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Force

If a material with high dielectric constant is used to reduce AiP size, then the dielectric constant increases, but the dielectric loss tangent also increases causing transmission signal loss

Engineering Contradiction:

Improvedielectric constantVSAvoiddielectric loss tangent

Core Design Contradiction:

ForceVSLoss of energy

Solution Approach 1:

The patent uses a composite inorganic filler system combining calcium titanate (60-80 vol%) and strontium titanate (20-40 vol%) particles within an epoxy resin matrix. This composite material approach allows the resin to achieve a high dielectric constant (10-40) while maintaining low dielectric loss tangent (0.020 or less) at 10 GHz, resolving the trade-off between signal confinement and transmission loss

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent optimizes the volume ratio of calcium titanate to strontium titanate particles, specifying that calcium titanate should constitute 60-80 vol% of the total inorganic filler. This precise parameter control allows tuning of the dielectric properties to achieve both high dielectric constant for miniaturization and low dielectric loss for efficient signal transmission

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composition effectively balances high dielectric constant and low dielectric loss tangent, reducing transmission signal loss and enhancing communication efficiency in high-frequency electronic devices, particularly in antenna-in-packages.

Implementation Method 1

By using a composition from which a cured product having a high dielectric constant can be obtained, it is possible to reduce the size of AiPs

Methodology Applied

Scientific EffectDielectric constant: Dielectric Permittivity

Implementation Method 2

a material having a high dielectric constant often has a high dielectric loss tangent. If a material having a high dielectric loss tangent is used, transmission signals are converted into heat due to transmission loss

Methodology Applied

Scientific EffectDielectric loss: Dielectric Permittivity

Data Source

PatentUS20240026118A1Molding resin composition and electronic component device

Publication Date: 2024.01.25 RESONAC CORP

AI summary

A molding resin composition includes: an epoxy resin; a curing agent; and an inorganic filler containing at least one selected from the group consisting of calcium titanate particles and strontium titanate particles, in which a total content of the calcium titanate particles and the strontium titanate particles is 60% by volume to 80% by volume with respect to a total amount of the inorganic filler.