3D Molding Equipment Continuous Scanning Path
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Solution Overview
Problem
Existing three-dimensional molding techniques face inefficiencies and shape deformation issues due to prolonged molding times and uneven temperature distributions caused by the use of galvano scanner devices, which result in increased waiting times and temperature differences during the sintering process.
Innovation Solution
The implementation of a three-dimensional molding equipment and method that employs a continuous molding path for the light beam or electron beam, avoiding intersections and using a continuous radiation process to reduce waiting times and temperature distribution irregularities, with scanning routes set at predetermined angles and distances to prevent shape deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If a galvano scanner device is used to radiate light beam or electron beam in linear scanning routes, then the molding path can be preliminarily set and the location can be moved fast, but the molding time is prolonged due to waiting time for determining radiated position multiple times
Solution Approach 1:
The patent implements continuous scanning routes where the light beam or electron beam radiates continuously without turning off during route transitions. The beam moves from one scanning route to the next in a continuous manner, eliminating the waiting time caused by turning the beam source on and off multiple times, thus improving molding efficiency while maintaining fast beam movement.
2Ease of manufacture
If linear scanning routes are used from one side to the other side, then the scanning can be completed systematically, but temperature distribution becomes uneven and shape deformation such as warpage may occur
Solution Approach 1:
The patent introduces curved scanning routes that follow the contour of the object being molded, replacing straight linear paths. This curved approach allows the beam to scan in a manner that maintains more uniform temperature distribution across the object, preventing warpage and shape deformation while still completing the scanning process systematically.
Solution Approach 2:
The patent adds a new dimension to the scanning approach by implementing spiral or circular scanning patterns instead of simple linear paths. This dimensional change in the scanning trajectory enables the beam to cover the object surface in a way that distributes heat more evenly, preventing localized overheating and subsequent deformation.
3Measurement precision
If the light beam or electron beam is turned ON and OFF multiple times during scanning, then the radiated position can be determined at predetermined positions, but the molding time is prolonged due to waiting time
Solution Approach 1:
The patent maintains continuous radiation of the light beam or electron beam throughout the entire scanning process, including during transitions between different scanning routes. This eliminates the need to turn the beam source on and off multiple times, removing the associated waiting time while still achieving precise position control through continuous beam movement along predetermined paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces molding time and prevents shape deformation, such as warpage, by maintaining continuous radiation along non-intersecting paths and optimizing temperature distribution within the plastic object.
Implementation Method 1
a process of radiating a light beam or an electron beam to a predetermined region of the powder layer formed in the mentioned process to sinter the powder in the predetermined region
Data Source
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AI summary
A three-dimensional molding equipment and a method for manufacturing the same comprise a powder supply equipment (40) which includes a laminating process to form a powder layer; and a light beam or electron beam scanning unit (20) which includes a sintering process to radiate a light beam or an electron beam to the powder layer and move a location radiated by the light beam or the electron beam to sinter the powder layer, wherein the laminating process and the sintering process are configured to alternately repeat, a molding path to be a scanning route of the light beam or electron beam on the inside of an object to be molded is preliminarily set as a continuous route which does not pass the same line and does not form any intersection, and the light beam or electron beam by the light beam or electron beam scanning unit (20) is continuously radiated along the molding path.