Molding System with Dynamic Clamping for Uniform Pressure
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Solution Overview
Problem
The increasing demand for smaller semiconductor devices and larger substrates leads to challenges in encapsulation, including increased resistance to molding compound flow, void formation, and mold bleed due to uneven substrate thickness and positioning, which results in incomplete filling and cosmetic issues.
Innovation Solution
A molding system with dual mold chases, sensors, and actuators that adjust clamping pressure and distance to ensure uniform pressure and alignment, allowing for efficient filling of the molding cavity by reducing the flow distance of the molding compound and compensating for uneven substrate thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the molding cavity height is reduced to accommodate smaller semiconductor devices, then the device size is reduced, but the resistance to molding compound flow increases and voids arise
Solution Approach 1:
The mold chase surfaces are made movable rather than fixed, allowing dynamic adjustment of the clamping pressure. The actuators enable real-time modification of the distance between mold chase surfaces, optimizing the cavity height during the molding process to prevent voids while maintaining compact device dimensions.
Solution Approach 2:
The system changes the physical parameter of cavity height dynamically during the molding process. By adjusting the distance between mold chase surfaces through actuators, the system optimizes the molding cavity dimensions to match the substrate thickness, ensuring proper flow of molding compound and preventing void formation.
2Area of stationary object
If the molding cavity is widened to accommodate larger substrates, then the substrate size is increased, but the difficulty of filling the cavity increases
Solution Approach 1:
The movable mold chase surfaces allow the cavity dimensions to be dynamically adjusted during the molding process. This enables the system to accommodate larger substrates while maintaining optimal filling conditions through real-time adjustment of the cavity geometry.
Solution Approach 2:
The system performs preliminary positioning and alignment of the substrate using sensors and actuators before the molding compound is introduced. This preliminary action ensures proper positioning and optimizes the cavity dimensions in advance, facilitating efficient filling of larger cavities.
3Manufacturing precision
If the clamping pressure is increased to prevent substrate movement, then the substrate positioning is improved, but the risk of mold bleed increases
Solution Approach 1:
The movable mold chase surfaces with actuators enable dynamic control of clamping pressure. The system can adjust the pressure in real-time during the molding process, applying sufficient force to prevent substrate movement while avoiding excessive pressure that would cause mold bleed.
Solution Approach 2:
Sensors detect the position and status of the substrate and mold chase surfaces, providing feedback to the actuators. This feedback mechanism enables precise control of clamping pressure, adjusting it dynamically to maintain optimal substrate positioning while preventing mold bleed.
4Ease of manufacture
If the substrate thickness is uneven, then the substrate manufacturing is simplified, but the uniformity of clamping pressure decreases and mold bleed occurs
Solution Approach 1:
The movable mold chase surfaces allow dynamic adjustment of the clamping pressure distribution. The actuators enable real-time modification of the cavity dimensions to compensate for uneven substrate thickness, ensuring uniform clamping pressure across the entire substrate surface.
Solution Approach 2:
The system applies different levels of clamping pressure to different regions of the substrate based on local thickness variations. The movable mold chase surfaces enable localized adjustment of pressure distribution to compensate for uneven substrate thickness while maintaining overall uniformity.
Data Source
AI summary
A molding system for encapsulating electronic devices mounted on a substrate, the molding system comprising a first mold chase with a first mold chase surface and a second mold chase with a second mold chase surface opposite to the first mold chase surface, the first and second mold chase surfaces being operative to clamp onto the substrate and to apply a clamping pressure thereto. The molding system further comprises a first sensor located at a first position for determining a first relative distance between the substrate and a mold chase facing the substrate at the first position, and a second sensor located at a second position for determining a second relative distance between the substrate and a mold chase facing the substrate at the second position. The molding system also comprises a first actuator located adjacent to the first position and a second actuator located adjacent to the second position, wherein the first and second actuators are operative to adjust the first relative distance with respect to the second relative distance for applying a uniform clamping pressure onto the substrate.