Molding System for Glass Substrate Edge Protection
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Solution Overview
Problem
The semiconductor industry faces challenges in handling glass substrates due to their fragility, which can lead to edge chipping and stress-induced splitting during advanced packaging processes. Conventional coating methods like inkjet printing are slow and risk contaminating the top surface of the glass.
Innovation Solution
A molding system and method that precisely applies a layer of mold material exclusively onto the side surfaces of semiconductor workpieces, such as glass substrates, using closed-loop elements on mold panels to create seals and prevent material from reaching the top and bottom surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If inkjet printing is used to coat the edges of the workpiece, then the edges can be protected, but the top surface may be contaminated and the process is slow
Solution Approach 1:
The patent replaces the mechanical inkjet printing process with an injection molding process that uses fluid pressure to deliver coating material. The injection molding system uses a mold cavity and plunger to inject coating material directly onto the edge, eliminating the need for mechanical dispensing and significantly increasing production speed while preventing top surface contamination through precise material placement.
Solution Approach 2:
The patent introduces a mold cavity as an intermediary between the coating material and the workpiece edge. The mold cavity confines the coating material during injection, ensuring it only contacts the edge surface. This intermediary structure enables precise control of material placement, achieving both high productivity and edge-specific protection without contaminating the top surface.
2Reliability
If inkjet printing is used to coat the edges, then edge protection is provided, but the process is notably slow
Solution Approach 1:
The injection molding process replaces the slow mechanical inkjet printing with a high-speed fluid injection system. The plunger-driven injection mechanism can deliver coating material rapidly and consistently, reducing the coating process time significantly while maintaining reliable edge protection through complete and uniform coverage.
Solution Approach 2:
The injection molding process enables continuous coating of multiple workpieces in sequence. The mold cavity and injection system are designed to maintain continuous operation, with the plunger delivering material in a steady stream that can coat edges continuously as workpieces are fed through the system, eliminating the intermittent nature of inkjet printing and reducing overall process time.
3Reliability
If conventional coating methods are used, then edges can be coated, but there is a risk of contaminating the top surface
Solution Approach 1:
The mold cavity serves as a confining intermediary that physically restricts the coating material to the edge region only. During injection, the material is contained within the mold cavity boundaries and can only exit onto the edge surface, preventing any contact with the top surface. This intermediary structure eliminates the contamination risk inherent in conventional coating methods.
Solution Approach 2:
The injection molding process applies coating material with high spatial precision, delivering it exclusively to the edge region where protection is needed. The mold cavity geometry and injection pressure control ensure that the coating material does not spread beyond the intended edge area, achieving local quality application that protects edges while leaving the top surface clean and uncontaminated.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a robust protective layer around the side surfaces of glass substrates, enhancing their durability and preventing splitting during handling and thermal cycling, while maintaining the top and bottom surfaces free from contamination and material.
Implementation Method 1
closed-loop elements on mold panels to create seals and prevent material from reaching the top and bottom surfaces
Data Source
AI summary
Various aspects may provide a molding system. The molding system may include a molding unit which includes a first mold panel and a second mold panel. The first mold panel and the second mold panel may include a mold cavity which surrounds a semiconductor workpiece along a side surface of the semiconductor workpiece, with the first mold panel and the second mold panel engaged with the semiconductor workpiece. Various aspects may also provide a molding method which utilize the molding system.