Molding-Type Substrates for LCD Lamp Support

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Solution Overview

Problem

Conventional LCD devices with electrode PCBs face issues such as bending, foreign material occurrence, and increased costs due to the need for additional insulation and surface mount processes for fixing lamps, which can lead to gripper distortion.

Innovation Solution

The implementation of molding-type substrates with integrally formed conductive wires and grippers, encapsulated in a mold frame, which simplifies fabrication and eliminates the need for a large PCB, reducing the risk of distortion and eliminating the requirement for additional insulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stability of the object's composition

If a large electrode PCB is used to support multiple lamps, then the structural stability is improved, but the device complexity and manufacturing cost increase due to additional insulation requirements and surface mount processes

Engineering Contradiction:
Improvestructural stabilityVSAvoiddevice complexity
Core Design Contradiction:
Stability of the object's compositionVSDevice complexity

Solution Approach 1:

The patent combines the PCB substrate, insulation structure, and lamp holder (gripper) into a single integrated molding-type substrate. The conductive wire is directly embedded in the molded substrate material, eliminating the need for separate PCB, insulation sheets, and mounting hardware. This merging of components reduces device complexity while maintaining structural stability through the unified molded structure.

Inventive Principle:
Principle #5Merging (Combining)

2Ease of manufacture

If conventional PCB with separate components is used, then the manufacturing process is standardized, but the manufacturing precision deteriorates due to gripper distortion from surface mount processes

Engineering Contradiction:
Improvemanufacturing process standardizationVSAvoidgripper positioning precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The gripper is integrally formed with the conductive wire and molded substrate as a single piece, eliminating separate surface mount operations. The molding process directly forms the gripper in its final position, ensuring precise positioning without distortion from soldering or mounting processes, while remaining compatible with standardized injection molding manufacturing.

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If conventional PCB structure is used, then the electrical connection is established, but the reliability decreases due to foreign material occurrence and bending issues

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidforeign material occurrence
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent uses a composite structure where conductive wires are embedded within an insulating molded substrate material. This composite design provides inherent insulation, eliminating the need for separate insulation sheets and reducing foreign material contamination risks. The integrated structure also prevents PCB bending issues by distributing mechanical stress throughout the molded substrate.

Inventive Principle:
Principle #40Composite materials

4Reliability

If additional insulation sheets and mounting hardware are used, then the electrical safety is improved, but the productivity decreases due to multiple assembly steps

Engineering Contradiction:
Improveelectrical safetyVSAvoidassembly productivity
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The insulation structure and electrical connection components are merged into a single molded substrate piece. The molded substrate itself provides electrical insulation while containing the conductive wires, eliminating the need for separate insulation sheets, mounting hardware, and multiple assembly steps. This integration maintains electrical safety through the insulating material while significantly improving productivity by reducing assembly operations.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS8120725B2Liquid crystal display device with particular molding-type substrates
Publication Date: 2012.02.21 LG DISPLAY CO LTD
  • US8120725B2 patent drawing
  • US8120725B2 patent drawing
  • US8120725B2 patent drawing

AI summary

Disclosed is an LCD device having molding-type substrates formed so as to have a controllable thickness through simplified fabricating processes. The LCD device comprises: a lower cover; a plurality of lamps disposed on the lower cover with a constant interval therebetween, and providing light; molding-type substrates disposed at both sides of the lower cover, and having lamps coupled thereto; and an LC panel disposed on the lamps, and receiving light, wherein each of the molding-type substrates comprises: a conductive wire to which a voltage is supplied from outside; grippers integrally formed on the conductive wire with a constant interval therebetween, and coupling the lamps; and a bar-shaped mold frame including the conductive wire therein, and exposing the grippers to outside.