Millimeter-Wave Molecular Clock Package With Vertical Waveguides
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a need for a cost-effective, robust, and reliable packaging solution for millimeter wave molecular clock modules that can maintain high stability over temperature and time, as existing solutions are either too expensive or lack the necessary precision for applications like navigation and autonomous vehicle control.
Innovation Solution
A package substrate with a physics cell mounted on one side and millimeter wave transmitter and receiver modules on the other, featuring openings lined with conductors to act as vertical waveguides, allowing for efficient transmission and reception of millimeter wave signals, and using inexpensive substrate materials to reduce costs while maintaining stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If expensive high-performance substrates are used, then stability and precision are improved, but cost increases
Solution Approach 1:
The patent applies this principle by using inexpensive standard substrates (such as FR-4 PCBs) instead of expensive high-performance substrates. The substrate serves its functional purpose for signal transmission and mechanical support without requiring premium materials, thereby reducing cost while maintaining adequate stability for the molecular clock application.
Solution Approach 2:
The patent changes the parameter of substrate material selection from high-performance expensive materials to standard inexpensive materials. This parameter change is compensated by optimizing other aspects of the package design, such as the waveguide structure and component layout, to maintain signal integrity and stability without requiring costly substrates.
2Ease of manufacture
If standard inexpensive substrates are used, then cost is reduced, but signal transmission performance may deteriorate
Solution Approach 1:
The patent applies local quality by concentrating the high-performance requirements only where needed - specifically in the waveguide structures and signal transmission paths - while using standard substrates for the bulk of the package. The openings lined with conductors create localized high-performance transmission channels that compensate for the limitations of standard substrate materials.
Solution Approach 2:
The patent introduces conductor-lined openings as intermediary structures that mediate between the standard substrate and the millimeter wave signals. These waveguide-like structures act as intermediaries that enable high-frequency signal transmission through the standard substrate without requiring the substrate itself to have high-performance characteristics.
3Reliability
If complex packaging structures are used, then stability is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the package substrate: mechanical support for the physics cell, signal transmission pathways, and shielding structures. By combining these functions into a single integrated substrate design, the package achieves stability without requiring multiple separate complex components.
Solution Approach 2:
The package substrate serves multiple universal functions: it provides mechanical mounting for the physics cell, creates waveguide structures through conductor-lined openings, provides signal transmission paths, and offers electromagnetic shielding. This multi-functionality reduces the need for additional specialized components, simplifying the overall package structure while maintaining stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a stable and cost-effective package for millimeter wave molecular clock modules, ensuring high stability over a wide temperature range and reducing the need for expensive high-performance substrates, thus enhancing integration and ease of use.
Implementation Method 1
a first opening extending through the package substrate and lined with a conductor, the first opening aligned with the first end of the physics cell; a second opening extending through the package substrate and lined with the conductor... a millimeter wave transmitter module... having a millimeter wave transfer structure including a transmission line coupled to an antenna configured to transmit millimeter wave signals aligned with the first opening; and a millimeter wave receiver module... having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals from the physics cell
Implementation Method 2
The dipolar gas in the physics cell absorbs maximum energy at quantized frequencies which cause a molecular rotational transition. The transmitted signal frequency can be adjusted until a molecular rotational transition is detected, the energy absorption of the molecular rotation transition can be detected as a drop in amplitude of the remaining energy received from the physics cell.
Data Source
AI summary
In a described example, an apparatus includes a package substrate having a device side surface and a board side surface opposite the device side surface, a physics cell mounted on the device side surface having a first end and a second end, a first opening extending through the package substrate and lined with a conductor, aligned with the first end, a second opening extending through the package substrate and lined with the conductor, aligned with the second end, a millimeter wave transmitter module on the board side, having a millimeter wave transfer structure including a transmission line coupled to an antenna aligned with the first opening, and a millimeter wave receiver module mounted on the board side surface of the package substrate and having a millimeter wave transfer structure including a transmission line coupled to an antenna for receiving millimeter wave signals, aligned with the second opening.


