Molecular Film Patterning for Conductive Structures
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Solution Overview
Problem
Conventional photolithography methods for manufacturing conductive patterns are wasteful, environmentally harmful due to organic solvents, and costly, with ink-jet and microcontact printing methods facing challenges in precision and scalability for producing various conductive patterns.
Innovation Solution
A method involving the formation of molecular films using specific molecules like CF3(CF2)n(CH2)mSH and CF3(CF2)p(SS)(CH2)q′(CF2)p′CF3 on conductive films, which act as resist films when exposed to etchants, allowing for precise patterning without the need for baking and reducing material waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography method is used to pattern metal film, then conductive patterns can be formed, but at least 90% of resist liquid is wasted and organic solvents are used in large amounts
Solution Approach 1:
The patent extracts and removes the problematic resist liquid application and development steps from the conventional photolithography process. Instead of applying resist liquid to the entire substrate and then developing it, the invention directly forms patterns using ink-jet printing or microcontact printing methods, eliminating the need for resist liquid and development processes, thereby removing the source of 90% material waste
Solution Approach 2:
The patent uses a stamp as a physical copy or template of the desired pattern. The stamp is impregnated with metal paste and directly transferred to the substrate, creating the pattern without requiring resist liquid, exposure, or development steps. This copying approach eliminates material waste associated with conventional photolithography
2Manufacturing precision
If photolithography method is used to pattern metal film, then conductive patterns can be formed, but expensive photomask is needed for each pattern
Solution Approach 1:
The patent replaces expensive photomasks with a reusable stamp that can be used multiple times to transfer patterns. The stamp serves as a durable physical copy that eliminates the need to create new photomasks for each pattern, significantly reducing manufacturing costs while maintaining pattern precision
Solution Approach 2:
The stamp can be used to create multiple different patterns by changing the impregnation solution or the stamp itself, making it a universal tool that replaces multiple specialized photomasks. This multi-functionality reduces the need for expensive pattern-specific photomasks
3Manufacturing precision
If photolithography method is used to pattern metal film, then conductive patterns can be formed, but a number of steps are required
Solution Approach 1:
The patent combines multiple separate steps of conventional photolithography (resist application, exposure, development, etching) into a single direct patterning step. The ink-jet or microcontact printing method deposits patterned material directly onto the substrate, merging multiple processes into one efficient operation that maintains precision while improving productivity
Solution Approach 2:
The patent extracts and removes unnecessary intermediate steps from the conventional multi-step photolithography process. By eliminating resist application, exposure, and development steps, the invention reduces the number of process steps while maintaining the ability to form precise conductive patterns
4Loss of substance
If ink-jet method is used to discharge metal paste, then material waste is reduced, but baking step is required to increase conductivity
Solution Approach 1:
The patent uses self-assembling molecular films that automatically form the desired pattern without requiring external baking or heating steps. The molecules spontaneously organize into conductive pathways after deposition, making the process self-sufficient and eliminating additional processing steps that would increase device complexity
5Manufacturing precision
If microcontact printing method is used to form resist pattern, then submicron width can be achieved, but stamp production is required for each pattern
Solution Approach 1:
The patent creates a universal stamp that can produce multiple different patterns by changing the impregnation solution rather than requiring a new stamp for each pattern. This makes the stamp a versatile tool that maintains submicron precision while enabling production of various conductive patterns without additional stamp fabrication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the high-precision manufacturing of conductive patterns and field effect transistors with improved conductivity and reduced contamination, suitable for various substrates and scalable production without the need for expensive photomasks.
Implementation Method 1
a molecule that is expressed by Formula (1): CF3(CF2)n(CH2)mSH, where n indicates a natural number in the range of 3 to 7 while m denotes a natural number in the range of 8 to 18
Implementation Method 2
removing the conductive film located in a part where the molecular film has not been formed, by bringing the conductive film into contact with an etchant for the conductive film
Data Source
AI summary
The manufacturing method includes forming a molecular film 16 of at least one kind of molecule on a part of a conductive film 13 by placing, on the conductive film 13, a solution 12 containing the one kind of molecule dissolved therein, with the one kind of molecule being selected from the group consisting of: a molecule expressed by Formula (1): CF3(CF2)n(CH2)mSH, where n indicates a natural number of 3 to 7 while m denotes a natural number of 8 to 18; and a molecule expressed by Formula (2): CF3(CF2)p(CH2)qSS(CH2)q′(CF2)p′CF3, where p and p′ each are a natural number of 3 to 7 independently while q and q′ each are a natural number of 8 to 18 independently. Subsequently, the conductive film 13 located in a part where the molecular film 16 has not been formed is removed by bringing the conductive film 13 into contact with an etchant for the conductive film 13. Thus, a conductive pattern 17 is formed.