Molten Metal Surface Control for Ultrafine Copper Alloy Wire

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Solution Overview

Problem

Conventional methods for controlling molten metal surface height in continuous casting are not precise, leading to unstable ingot quality and limitations in producing ultrafine copper alloy wires due to microscopic defects, especially in rotational transfer molds where small fluctuations cause significant surface changes.

Innovation Solution

A method using a camera to monitor the molten metal surface, analyzing the image data to set a predetermined analysis band, binarizing the data, calculating the rate of change, and adjusting the spout opening based on the surface height to maintain a stable molten metal level, minimizing the effects of ruffles and splashes, and correcting for equipment vibrations and mold changes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional image analysis methods are used to monitor molten metal surface, then the system is simple to implement, but the measurement precision is insufficient due to ruffles and irregular points affecting accuracy

Engineering Contradiction:
Improvemolten metal surface height measurement precisionVSAvoidimage analysis system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent divides the image analysis into multiple scanning lines across the molten metal surface, analyzing each line independently to identify and exclude irregular points. This segmentation approach allows precise measurement by focusing on specific regions while filtering out noise from ruffles and surface irregularities.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces an intermediary analysis process that scans multiple lines and identifies consistent surface height points across different scan lines. This intermediary step filters out irregular measurements caused by ruffles, providing a more reliable surface height measurement before control action is taken.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If rotational transfer mold is used for continuous casting, then productivity is improved, but the manufacturing precision deteriorates because small fluctuations in molten metal injection cause large surface height changes

Engineering Contradiction:
Improvecontinuous casting productivityVSAvoidingot quality stability
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent implements a feedback control system that continuously monitors molten metal surface height using image analysis and automatically adjusts the spout opening to maintain stable surface level. This closed-loop control compensates for fluctuations in molten metal injection, ensuring consistent ingot quality while maintaining high productivity of rotational transfer mold casting.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent employs dynamic adjustment of the spout opening based on real-time surface height measurements. The system continuously adapts the injection rate to maintain stable molten metal level, allowing the system to respond to changing conditions and maintain precision despite the high-speed operation of rotational transfer mold.

Inventive Principle:
Principle #15Dynamics

3Manufacturing precision

If molten metal surface height is not controlled precisely, then the operation is simple, but the manufacturing precision of ultrafine copper alloy wires deteriorates due to microscopic defects in ingot

Engineering Contradiction:
Improveultrafine copper alloy wire qualityVSAvoidsurface control system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent uses feedback control to maintain stable molten metal surface height during continuous casting, preventing the formation of microscopic defects that would affect ultrafine wire quality. The system monitors surface height and adjusts injection accordingly, ensuring high-quality ingot production suitable for ultrafine wire manufacturing.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent applies preliminary control actions to prevent defect formation in the ingot by maintaining stable molten metal surface height throughout the casting process. By controlling the surface level in advance, the system prevents microscopic defects before they can affect the final wire quality, enabling successful production of ultrafine copper alloy wires.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for accurate and stable control of the molten metal surface, reducing defects in ingot quality and enabling the production of high-quality ultrafine copper alloy wires with increased wire drawing capability.

Implementation Method 1

a camera that records image of surface of molten metal within said mold

Methodology Applied
Scientific EffectOptical imaging: Photography

Data Source

PatentUS8509942B2Method for producing metal ingot, method for controlling liquid surface, and ultrafine copper alloy wire
Publication Date: 2013.08.13 FURUKAWA ELECTRIC CO LTD
  • US8509942B2 patent drawing
  • US8509942B2 patent drawing
  • US8509942B2 patent drawing

AI summary

Surface 27 of molten metal within a mold is constantly monitored by camera 25. Camera 25 records the surface from an obliquely upward position of the mold in an area that does not affect the casting process. Various analyzing frames such as analysis band 35, molten metal pattern 37, and injection monitoring part 43, are set with respect to the information recorded by the camera 25. The analysis band 35 includes the surface (molten metal part 31c), and is set to a predetermined width so that the direction of surface change is in the longitudinal direction. The width of the analysis band 35 is set as wide as possible in a range that does not block the discharge part (molten metal part 31a). Inside the analysis band 35, the rate of change of the binary data is calculated by the analyzing part.