Monolithic Molybdenum PVD Target Structure for Low-Deflection Sputtering
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Solution Overview
Problem
There is a need for a sputtering target apparatus with an improved life span to ensure high-quality thin films in physical vapor deposition processes, as the choice of target material and design significantly influence the deposition process and target life.
Innovation Solution
A monolithic molybdenum PVD target assembly with a support region, mounting region, and recess design, which includes a channel and a coating to enhance rigidity and reduce thermal stress, eliminating the need for a backing plate, thereby improving target life and film uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Duration of action of stationary object
If a conventional sputtering target design is used, then the target can be easily manufactured, but the target life is limited and deflection occurs under thermal stress
Solution Approach 1:
The target is divided into a support region and a mounting region with distinct functions. The support region provides structural integrity and thermal stress resistance, while the mounting region facilitates secure attachment to the backing plate. This segmentation allows each region to be optimized for its specific purpose, extending target life without compromising strength.
Solution Approach 2:
Different regions of the target are given different properties: the support region has enhanced mechanical strength to resist deflection, while the mounting region has optimized geometry for secure attachment. The radial sidewalls and recess features create localized structural enhancements where needed, improving overall target life without uniformly increasing complexity.
2Manufacturing precision
If the target design lacks proper structural features, then manufacturing is simpler, but film uniformity deteriorates due to target deflection
Solution Approach 1:
By segmenting the target into functional regions with specific geometric features (radial sidewalls, recesses), the design achieves precise control over target deflection during sputtering. This segmentation ensures uniform film deposition while maintaining a manufacturable structure through standard machining operations.
Solution Approach 2:
The target geometry is pre-designed with built-in stress distribution features (radial sidewalls, recesses) that proactively compensate for thermal expansion and mechanical loads during operation. This preliminary structural preparation prevents deflection-induced non-uniformity before it occurs, ensuring consistent film quality without adding operational complexity.
3Duration of action of stationary object
If the target mounting structure is inadequate, then assembly is simpler, but target life is reduced due to increased stress and deflection
Solution Approach 1:
The mounting structure is segmented into distinct features: a mounting face for attachment, radial sidewalls for positional stability, and recesses for stress distribution. This segmentation creates a robust mounting system that extends target life while remaining compatible with standard backing plate configurations and manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The monolithic design enhances target life and reduces deflection, leading to improved film uniformity and extended service life by minimizing thermal and mechanical stress, thus optimizing the deposition process.
Implementation Method 1
PVD operates under vacuum conditions and involves the evaporation or sputtering of target materials, such as metals or ceramics, onto a semiconductor substrate to form thin films. In sputtering, high-energy ions bombard the target material of the target assembly, dislodging atoms from a target that are then deposited onto the substrate.
Implementation Method 2
Physical Vapor Deposition (PVD) is a crucial thin-film deposition technique extensively employed in semiconductor substrate processing to create thin layers of materials with enhanced properties.
Data Source
AI summary
The disclosure relates to a target for physical vapor deposition processes. In one embodiment, a physical vapor deposition (PVD) target, includes a monolithic target with a support region partially defined by a process face and radial sidewalls; and a recess within a mounting face of the monolithic target, the recess disposed opposite the process face and extending radially outward of the radial sidewalls.