Molybdenum Wiring Structure for Stronger Insulating Layer Bonding
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Solution Overview
Problem
The bonding strength between the insulating layer and the wiring layer in electronic devices is weak, leading to easy peeling and potential damage to the wiring layer.
Innovation Solution
A wiring structure is designed with an outer metal layer containing no molybdenum and an inner metal layer containing molybdenum, along with an oxide insulating layer and a nitride insulating layer, which enhances bonding strength between the outer metal layer and the oxide insulating layer to prevent peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an insulating layer covers the wiring layer to protect it, then the wiring layer is protected, but the bonding strength between the insulating layer and the wiring layer becomes weak and the insulating layer peels easily
Solution Approach 1:
The wiring layer is divided into inner metal layer and outer metal layer. The oxide insulating layer is positioned between the nitride insulating layer and the inner metal layer, not directly on the outer metal layer. This segmentation prevents direct contact between the oxide insulating layer and outer metal layer, avoiding peeling issues while maintaining protection functionality.
Solution Approach 2:
The inner metal layer acts as an intermediary between the oxide insulating layer and the outer metal layer. By positioning the oxide insulating layer on the inner metal layer rather than directly on the outer metal layer, the patent creates a buffer zone that prevents peeling while maintaining the protective function of the insulating layers.
2Device complexity
If the oxide insulating layer touches the outer metal layer directly, then the structure is simple, but the bonding strength is insufficient and peeling occurs
Solution Approach 1:
The patent segments the interaction between insulating layers and metal layers by positioning the oxide insulating layer on the inner metal layer rather than directly on the outer metal layer. This segmentation creates distinct functional zones that prevent peeling while maintaining reasonable structural complexity.
Solution Approach 2:
The inner metal layer serves as an intermediary layer that mediates between the oxide insulating layer and the outer metal layer. This intermediary positioning ensures strong bonding between the oxide insulating layer and the metal structure without requiring direct contact with the outer metal layer, thus preventing peeling.
3Stability of the object's composition
If the insulating layer peels from the wiring layer, then the structure integrity is compromised, but the damage to the wiring layer can be prevented by proper design
Solution Approach 1:
By segmenting the wiring structure into inner and outer metal layers and positioning the oxide insulating layer on the inner metal layer, the patent creates a structure where peeling cannot occur between the oxide insulating layer and outer metal layer, thus maintaining structural integrity and preventing wiring layer damage.
Solution Approach 2:
The inner metal layer acts as a protective intermediary that prevents direct peeling between the oxide insulating layer and the outer metal layer. This intermediary structure ensures that even if bonding challenges exist, the wiring layer remains protected from damage while maintaining overall structural integrity.
Data Source
AI summary
An electronic device includes a substrate, a wiring structure, an oxide insulating layer and a nitride insulating layer. The wiring structure is disposed on the substrate and includes an outer metal layer and an inner metal layer. The outer metal layer contains no molybdenum. The inner metal layer disposed between the outer metal layer and the substrate contains molybdenum. The oxide insulating layer is disposed on the wiring structure and directly touches the outer metal layer. The nitride insulating layer is disposed on the oxide insulating layer, where the oxide insulating layer is positioned between the nitride insulating layer and the outer metal layer.