MoNb-Seeded Wiring Substrate for Thick, Low-Resistance Lines
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Solution Overview
Problem
Existing LED manufacturing processes face challenges in achieving low resistance and high thickness of signal lines, leading to signal loss and increased power consumption, while also requiring expensive and time-consuming etching methods that hinder mass production efficiency.
Innovation Solution
A wiring substrate design incorporating signal lines and dummy conductive patterns formed using a specific electroplating process with a MoNb seed layer, allowing for thicker signal lines with reduced resistance and improved etching efficiency, thereby reducing power loss and production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional etching methods are used to form signal lines, then the signal lines can be formed, but the manufacturing process becomes expensive and time-consuming, reducing productivity
Solution Approach 1:
The patent replaces traditional mechanical etching methods with an electroplating process. Instead of removing material through etching, the invention uses electroplating to deposit conductive material onto the substrate, forming signal lines and dummy conductive patterns simultaneously. This substitution of manufacturing methodology dramatically reduces production time and cost while enabling mass production of LED substrates with low-resistance conductive paths.
Solution Approach 2:
The invention changes the fundamental manufacturing parameters by using electroplating conditions (electrical current, plating solution composition, plating time) instead of etching parameters. By controlling electroplating parameters, the process achieves precise thickness control of signal lines while maintaining low resistance, and simultaneously forms both signal lines and dummy conductive patterns in a single step, improving productivity.
2Device complexity
If thin signal lines are used, then the manufacturing process is simpler, but the resistance increases leading to signal loss and higher power consumption
Solution Approach 1:
The patent addresses the resistance issue by transitioning from a two-dimensional constraint (line width) to a three-dimensional solution (line thickness). By using electroplating, the process can deposit thick layers of conductive material vertically, creating signal lines with high thickness that provide low resistance paths. This dimensional approach allows maintaining simple manufacturing while achieving low resistance and low power consumption simultaneously.
Solution Approach 2:
The invention employs a composite structure consisting of a MoNb seed layer combined with electroplated conductive material. The MoNb seed layer provides excellent adhesion and catalytic properties, enabling uniform electroplating of thick copper or other conductive materials. This composite material system achieves superior electrical conductivity and mechanical adhesion, reducing signal loss and power consumption while maintaining manufacturing simplicity.
3Loss of energy
If signal lines are made thicker to reduce resistance, then power loss decreases, but the manufacturing process becomes more complex and expensive
Solution Approach 1:
The patent merges the formation of signal lines and dummy conductive patterns into a single electroplating step. Instead of separately forming thick signal lines and then adding dummy patterns, the process simultaneously deposits conductive material for both structures in one operation. This consolidation maintains thick signal lines for low power loss while simplifying the manufacturing process and reducing overall complexity and cost.
Solution Approach 2:
The MoNb seed layer serves as an intermediary that enables the electroplating process to efficiently deposit thick conductive material. The seed layer provides a uniform nucleation surface that facilitates controlled growth of thick copper layers with low resistance. This intermediary layer makes the thick-signal-line manufacturing process simpler and more cost-effective by enabling uniform, high-quality deposition in a single electroplating step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution achieves lower signal resistance, reduced power consumption, and enhanced manufacturing efficiency by utilizing a MoNb seed layer in the electroplating process, ensuring high thickness and uniformity of signal lines for improved LED performance and mass production capabilities.
Implementation Method 1
forming a plurality of signal lines and a plurality of dummy conductive patterns simultaneously on the first surface using a same patterning process
Data Source
AI summary
A wiring substrate and a method for manufacturing the same, a light-emitting substrate and a display apparatus are provided. The wiring substrate includes a substrate, a plurality of signal lines and a plurality of dummy conductive patterns. The substrate has a first surface. The plurality of signal lines are located on the first surface. The plurality of signal lines are arranged at intervals in a first direction and extend in a second direction, and the first direction intersects the second direction. The plurality of dummy conductive patterns are located on the first surface. At least part of the plurality of dummy conductive patterns are located in a same layer as the plurality of signal lines. A dummy conductive pattern is disposed between two adjacent signal lines, and the dummy conductive pattern is insulated from the two adjacent signal lines.