Monitor Wafer Loading Frequency Control in Substrate Processing

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Solution Overview

Problem

In semiconductor manufacturing, the frequent loading of monitor wafers to optimize processing results increases manufacturing costs, as current methods do not efficiently adjust the loading frequency based on processing results and predictive outcomes.

Innovation Solution

A control apparatus that adjusts the monitor substrate loading frequency in a substrate processing apparatus based on the difference between actual and predictive processing results, optimizing the loading frequency by varying it across multiple ranges to maintain processing accuracy and reduce costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the monitor wafer loading frequency is increased to optimize processing results, then processing accuracy is improved, but manufacturing cost increases

Engineering Contradiction:
Improveprocessing accuracyVSAvoidmonitor wafer loading frequency
Core Design Contradiction:
Manufacturing precisionVSQuantity of substance

Solution Approach 1:

The patent implements dynamic adjustment of monitor wafer loading frequency based on processing status. The system transitions from fixed frequent loading to adaptive loading where the frequency changes according to whether processing results meet predetermined standards, thereby optimizing both accuracy and cost

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system uses feedback from processing results to control future monitor wafer loading decisions. By comparing actual processing outcomes with predetermined standards, the system determines whether to continue frequent monitoring or reduce loading frequency, creating a closed-loop control mechanism

Inventive Principle:
Principle #23Feedback

2Ease of manufacture

If the monitor wafer loading frequency is decreased to reduce manufacturing costs, then cost efficiency is improved, but processing accuracy deteriorates

Engineering Contradiction:
Improvecost efficiencyVSAvoidprocessing accuracy
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The system dynamically adjusts monitoring intensity based on processing stability. When processing results consistently meet standards, the system reduces monitor wafer loading frequency to improve cost efficiency. When deviations occur, frequency increases to restore accuracy, creating adaptive cost-accuracy optimization

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The patent changes the parameter of monitor wafer loading frequency based on processing outcome parameters. By adjusting this frequency parameter in response to processing quality parameters, the system optimizes the balance between manufacturing cost and processing accuracy

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS9772624B2Control apparatus, substrate processing apparatus, and substrate processing system
Publication Date: 2017.09.26 TOKYO ELECTRON LTD
  • US9772624B2 patent drawing
  • US9772624B2 patent drawing
  • US9772624B2 patent drawing

AI summary

A control apparatus is configured to control an operation of a substrate processing apparatus configured to place at least a monitor substrate therein. The control apparatus controls the operation of the substrate processing apparatus based on a difference between a processing result of the monitor substrate processed by the substrate processing apparatus and a predictive result so as to optimize the monitor substrate loading frequency.