Monitor Wafer Cleaning Layer for In-Situ Particle Removal

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Solution Overview

Problem

The accumulation of particles in processing tools leads to contamination and tool downtime, requiring the opening and maintenance of the processing chamber, which is time-consuming.

Innovation Solution

A monitor wafer with a cleaning layer on its bottom surface is used to concurrently monitor the tool particle condition and remove particles from the substrate and processing tool, reducing the need for additional maintenance time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If particles are removed by opening and maintaining the processing chamber, then particle removal is achieved, but processing time is significantly increased

Engineering Contradiction:

Improveparticle removal effectivenessVSAvoidprocessing time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The processing chamber is segmented into a main processing area and a separate cleaning area. The cleaning layer is positioned in the cleaning area, allowing particle removal to occur in a isolated zone without interrupting the main processing operations. This spatial segmentation enables concurrent monitoring and cleaning while maintaining production continuity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A cleaning layer is introduced as an intermediary component between the processing chamber and the external environment. This cleaning layer acts as a mediator that captures and removes particles through chemical or physical cleaning mechanisms without requiring opening of the main processing chamber, thus maintaining the sealed environment and avoiding time loss.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the processing chamber is opened for particle removal, then contamination is eliminated, but tool uptime is reduced

Engineering Contradiction:

Improvecontamination levelVSAvoidtool uptime

Core Design Contradiction:

Object-affected harmful factorsVSProductivity

Solution Approach 1:

The cleaning layer enables continuous particle removal operations without interrupting the main processing workflow. By positioning the cleaning layer in a separate cleaning area that operates concurrently with processing, the system maintains continuous useful action in both monitoring and cleaning functions, eliminating downtime associated with opening the processing chamber.

Inventive Principle:

Principle #20Continuity of useful action

Solution Approach 2:

The cleaning layer performs self-service particle removal within the processing tool. It automatically captures and eliminates particles through its cleaning mechanism without requiring external intervention or chamber opening, thereby maintaining tool uptime while continuously eliminating contamination.

Inventive Principle:

Principle #25Self-service

3Reliability

If a cleaning layer is added to the monitor wafer, then particle removal capability is enhanced, but device complexity increases

Engineering Contradiction:

Improveparticle removal capabilityVSAvoidmonitor wafer structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The monitor wafer is designed with multi-functionality, serving both as a monitoring substrate and as a cleaning agent. The cleaning layer on the monitor wafer allows it to perform dual functions: monitoring particle conditions and actively removing particles. This universal design enhances particle removal capability without requiring separate dedicated cleaning devices, thus limiting the increase in overall device complexity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12325054B2Monitor wafer and method of using the same

Publication Date: 2025.06.10 UNITED MICROELECTRONICS CORP

AI summary

A monitor wafer is provided. The monitor wafer includes a substrate and a cleaning layer. The cleaning layer is disposed on a bottom surface of the substrate. The cleaning layer is configured to remove particles from the substrate and/or a processing tool.