Monitor Wafer Cleaning Layer for In-Chamber Particle Removal

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Solution Overview

Problem

Particles accumulate in processing tools, leading to contamination and tool downtime, requiring time-consuming chamber opening and maintenance for removal.

Innovation Solution

A monitor wafer with a cleaning layer on its substrate is used to concurrently monitor and remove particles, utilizing adhesion, adsorption, and van der Waals forces, reducing the need for additional maintenance time.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If particles are removed by opening and maintaining the processing chamber, then particles are removed from the tool, but the process is time consuming

Engineering Contradiction:

Improveparticle removal effectivenessVSAvoidmaintenance time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

A cleaning layer is deposited on the monitor wafer before it enters the processing chamber. This cleaning layer is pre-prepared to capture particles during the monitoring process itself, eliminating the need for separate particle removal operations and reducing maintenance time

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The cleaning layer acts as an intermediary between the monitor wafer substrate and particles in the processing chamber. This intermediate layer captures particles through adhesion and adsorption, allowing particle removal to occur concurrently with monitoring without requiring chamber opening

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a cleaning layer is added to the monitor wafer, then particle removal capability is improved, but the device complexity increases

Engineering Contradiction:

Improveparticle removal capabilityVSAvoidmonitor wafer structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

A thin cleaning layer is deposited on the monitor wafer substrate. This thin film structure provides particle removal functionality while maintaining the overall simplicity of the monitor wafer design, as the cleaning layer is applied as a coating rather than adding complex mechanical structures

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The monitor wafer consists of a substrate and a cleaning layer forming a composite structure. The substrate provides mechanical support while the cleaning layer provides particle capture functionality, combining different material properties to achieve both structural integrity and particle removal capability

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significantly reduces the time required for particle removal, extending the preventive maintenance cycle and increasing tool uptime by about 19.5 days per year.

Implementation Method 1

utilizing adhesion, adsorption, and van der Waals forces

Methodology Applied

Scientific EffectAdhesion: Adhesive

Implementation Method 2

utilizing adhesion, adsorption, and van der Waals forces

Methodology Applied

Scientific EffectAdsorption: Adsorption

Implementation Method 3

utilizing adhesion, adsorption, and van der Waals forces

Methodology Applied

Scientific Effectvan der Waals force: Van der Waals Force

Data Source

PatentUS20250269409A1Monitor wafer and method of using the same

Publication Date: 2025.08.28 UNITED MICROELECTRONICS CORP

AI summary

A monitor wafer is provided. The monitor wafer includes a substrate and a cleaning layer. The cleaning layer is disposed on a bottom surface of the substrate. The cleaning layer is configured to remove particles from the substrate and/or a processing tool.