Monoamine-Endcapped Polyimide Resins for Ultra-Low Contamination
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Solution Overview
Problem
High-end applications of polyetherimides, such as in semiconductors or fibers, require extremely low contamination levels to maintain processability and product performance, but common resin contaminants like phthalic anhydride m-phenylene diamine imide (PAMI) and stabilizers like Irgafos 168 lead to residual contamination issues.
Innovation Solution
The development of monoamine-endcapped polyimide components, specifically polyetherimides and polyetherimide sulfones, with less than 5 ppb releasable phosphorous and volatile organic compound residuals, achieved through processes like nitro-displacement and chloro-displacement, ensuring low contamination levels suitable for stringent cleanliness requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If phthalic anhydride m-phenylene diamine imide (PAMI) is used as an end cap in polyimide resin, then the resin displays excellent high temperature performance and easy processability, but the resin contains residual contamination that adversely affects processability and product performance in high-end applications
Solution Approach 1:
The patent removes the harmful PAMI end cap from the polyimide resin structure and replaces it with a monoamine end cap (such as aniline). This extraction of the contaminating end cap eliminates the source of residual contamination while preserving the beneficial high temperature performance through the main polyimide backbone structure.
Solution Approach 2:
The patent changes the chemical parameter of the end cap group from phthalic anhydride m-phenylene diamine imide (PAMI) to monoamine end caps. This parameter change in the end cap structure fundamentally alters the contamination profile, reducing residual contamination to levels suitable for high-end applications while maintaining thermal performance.
2Ease of manufacture
If stabilizer Irgafos 168 is added to the polymer prior to extrusion, then the color of the final resin is lowered, but residual stabilizer remains in measurable quantity in the resin pellets leading to higher particle counts
Solution Approach 1:
The patent removes or minimizes the presence of stabilizer Irgafos 168 from the resin composition. By taking out this stabilizer component, the resin achieves lower particle counts and reduced residual contamination while still achieving the desired color through alternative means, thus eliminating the harmful residual stabilizer.
3Ease of operation
If conventional polyetherimide resins are used, then the resin is easy to process and displays excellent high temperature performance, but the resin does not meet stringent cleanliness requirements for high end applications
Solution Approach 1:
The patent changes the chemical composition parameters of the polyetherimide resin by replacing PAMI end caps with monoamine end caps and adjusting stabilizer content. This parameter change achieves stringent cleanliness requirements (less than 5 ppb releasable phosphorous and volatile organic compound residuals) while preserving the ease of processing and high temperature performance.
Data Source
AI summary
Compositions and methods for producing compositions comprising a monoamine-endcapped polyimide component. Based on a gas chromatography mass spectroscopy analysis of a surface rinse of the composition performed at room temperature, the composition can have at least one surface with less than or equal to 5 ppb releasable phosphorous residuals, and less than or equal to 5 ppb releasable volatile organic compound residuals. The composition can also comprise less than or equal to 10 ppb combined releasable residuals. Because of the very low levels of residual contamination, the compositions can be used to produce a variety of articles including a disk drive.