Monolithic 3D Structures via Selective Layer Bonding

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Solution Overview

Problem

Manufacturing at the millimeter scale is plagued with fabrication and assembly issues, impacting the cost and performance of micro-robots and other functional mechanical devices, as existing MEMS technologies are limited by serial processes and material additions.

Innovation Solution

The development of three-dimensional structures formed by stacking patterned layers with selective bonding and distortion, allowing for the creation of expanded configurations using rigid and flexible layers, enabling mass production of precisely fabricated mechanisms and robots with lower thermal requirements and fabrication-equipment costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If traditional MEMS technology is used for millimeter-scale manufacturing, then fabrication processes can be established, but assembly issues and high costs occur due to serial processes and material addition limitations

Engineering Contradiction:
Improvefabrication processVSAvoidmass production capability
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The invention divides the monolithic structure into multiple planar layers that can be independently fabricated and then assembled. Each layer can be manufactured separately using standard PCB techniques, and then bonded together to form the complete three-dimensional structure, enabling parallel processing and mass production

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from traditional two-dimensional planar fabrication to three-dimensional structures by stacking multiple planar layers vertically. This allows complex 3D mechanisms to be constructed from flat layers that are bonded at selected locations and then distorted to create the final 3D configuration

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If multiple layers are stacked and bonded to form three-dimensional structures, then manufacturing precision and versatility improve, but process complexity increases

Engineering Contradiction:
Improvefabrication precisionVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

Alignment features such as holes and protrusions are pre-formed on each layer before stacking. These features automatically guide the layers into precise alignment during the bonding process, eliminating the need for complex alignment procedures and reducing process complexity

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

Adhesive layers serve as intermediaries between the rigid structural layers. The adhesive not only bonds the layers together but also accommodates minor dimensional variations and misalignments, simplifying the overall bonding process and improving manufacturing precision

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If flexible layers are used to connect rigid segments, then structural versatility and expandability improve, but rigidity control becomes more challenging

Engineering Contradiction:
Improvestructural versatilityVSAvoidrigidity control
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The structure uses rigid layers in regions requiring strength and stability, while flexible layers are used only in specific locations where movement and expansion are needed. This localized application of different material properties allows the structure to achieve both rigidity and versatility without compromising overall strength

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the mass production of precisely fabricated mechanisms and robots at the millimeter scale with reduced costs and thermal requirements, offering greater versatility in materials and processing efficiency compared to traditional MEMS technologies.

Implementation Method 1

the flexible layer can have at least 10 times or at least 100 times the flexibility of the rigid layers... the laminate structure can be distorted or flexed to produce an expanded three-dimensional structure

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS9833978B2Monolithic fabrication of three-dimensional structures
Publication Date: 2017.12.05 PRESIDENT & FELLOWS OF HARVARD COLLEGE
  • US9833978B2 patent drawing
  • US9833978B2 patent drawing
  • US9833978B2 patent drawing

AI summary

A multi-layer, super-planar structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded three-dimensional structure, wherein the layers are joined at the selected bonding locations and separated at other locations.