Monolithic Bent Support for MCPCB Thermal Management
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Solution Overview
Problem
Existing light generating devices, such as LED spotlights, require complex assembly processes due to multiple components and lack efficient thermal management and ingress protection.
Innovation Solution
A light generating device with a monolithic support comprising two bent support parts, where one part supports the light source and the other is thermally coupled to the housing and a thermally conductive element, eliminating the need for a separate heat spreader and simplifying assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If multiple separate components (PCB, heat spreader, connector) are used in light generating devices, then thermal management can be achieved, but the assembly process becomes complex and the number of components increases
Solution Approach 1:
The patent combines the PCB support and heat spreader functions into a single monolithic support structure. The support comprises a first support part for mounting the light source and a second support part that extends to contact the thermally conductive element, eliminating the need for separate heat spreader components and reducing assembly complexity while maintaining effective thermal management.
Solution Approach 2:
The monolithic support structure serves multiple functions simultaneously: it provides mechanical support for the light source, conducts heat away from the light source, and provides structural support within the housing. This multi-functional design reduces the total number of components needed in the light generating device.
2Reliability
If multiple separate components are used in light generating devices, then specific functions (support, heat dissipation) can be performed, but the number of components increases and assembly becomes more complicated
Solution Approach 1:
The patent merges the support structure and thermal management functions into a single integrated component. The monolithic support with its first and second support parts simultaneously provides mechanical support and thermal conduction, reducing component count while maintaining reliable functional performance.
3Temperature
If a conventional multi-component design is used, then thermal conduction paths can be established, but the assembly process requires more steps and time
Solution Approach 1:
By combining the support and heat spreader functions into one monolithic component, the patent reduces the number of assembly steps. The single component can be installed as one unit, establishing thermal conduction paths more quickly than assembling multiple separate components, thereby improving production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design provides improved thermal management and ingress protection while reducing the number of components, allowing for simpler assembly and effective heat dissipation.
Implementation Method 1
a second support part, of the at least two support parts, is associated to one or more of the housing wall and the thermally conductive element and is configured in thermal contact with the thermally conductive element
Data Source
AI summary
The invention provides a light generating device (1000) comprising (i) a light source (100), wherein the light source comprises a solid state light source, (ii) a support (200) for the light source (100), (iii) a housing (300) comprising a housing wall (310), and (iv) a thermally conductive element (400); wherein the support (200) is a monolithic support, wherein the support (200) comprises at least two support parts (210) which are configured bent relative to each other, wherein a first support part (211) of the at least two support parts (210) is configured to support the light source (100), and wherein a second support part (212) of the at least two support parts (210) is associated to one or more of the housing wall (310) and the thermally conductive element (400) and configured in thermal contact with the thermally conductive element (400), wherein the support (200) is thermally conductive.