Monolithic Ceramic Electrostatic Chuck Without Bonding Layer
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Solution Overview
Problem
Conventional electrostatic chucks (ESC) in substrate processing systems face issues such as ceramic coating breakdown under high voltage, mismatched thermal expansion leading to misalignment and stress, and limited thermal transfer due to the bonding layer, which results in reduced reliability and efficiency.
Innovation Solution
A monolithic ceramic ESC is developed without a bonding layer, featuring embedded electrodes and channels for electrostatic chucking, temperature control, and RF power delivery, utilizing ceramic green sheets of varying qualities for optimized performance and reduced thermal mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a bonding layer is used to join ceramic coating to substrate support, then assembly is facilitated, but thermal expansion mismatch causes misalignment and stress
Solution Approach 1:
The patent merges the ceramic coating and substrate support into a single monolithic ceramic body, eliminating the bonding layer interface. This integration removes the source of thermal expansion mismatch while maintaining structural integrity and electrical insulation properties throughout the entire ESC structure.
Solution Approach 2:
The patent employs composite ceramic structures with different material properties in different regions. The monolithic body uses ceramic materials selected for their thermal expansion characteristics that match the substrate, eliminating stress while maintaining mechanical strength and electrical insulation.
2Ease of manufacture
If a bonding layer is used to join ceramic coating to substrate support, then assembly is facilitated, but ceramic coating breakdown occurs under high voltage
Solution Approach 1:
The patent merges the ceramic coating and substrate support into a single monolithic ceramic body, eliminating the bonding layer interface that is susceptible to breakdown under high voltage. The unified structure ensures continuous electrical insulation and eliminates weak points where coating failure could occur.
3Ease of manufacture
If a bonding layer is used to join ceramic coating to substrate support, then assembly is facilitated, but thermal transfer is limited
Solution Approach 1:
The patent merges the ceramic coating and substrate support into a single monolithic ceramic body, eliminating the bonding layer that limits thermal transfer. The direct ceramic-to-substrate contact in the integrated structure enables efficient thermal conduction while maintaining electrical insulation through the ceramic material properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the operating temperature range, reduces thermal stress, improves RF bias control, and increases thermal conduction efficiency, leading to increased reliability and the ability to handle higher power applications.
Implementation Method 1
increases thermal conduction efficiency
Implementation Method 2
A plurality of first electrodes are arranged in the monolithic body adjacent to a top surface of the monolithic body and are configured to selectively receive a chucking signal
Data Source
AI summary
An electrostatic chuck for a substrate processing system includes a monolithic body made of ceramic. A plurality of first electrodes are arranged in the monolithic body adjacent to a top surface of the monolithic body and that are configured to selectively receive a chucking signal. A gas channel is formed in the monolithic body and is configured to supply back side gas to the top surface. Coolant channels are formed in the monolithic body and are configured to receive fluid to control a temperature of the monolithic body.