Monolithic Multi-Modal CMOS Imager for Sub-Micron Registration
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Solution Overview
Problem
Existing multi-modal imaging systems face challenges such as registration errors, mechanical translation/rotation issues, and the need for replication of readout/scan electronics, which hinder high-resolution, simultaneous data acquisition and increase costs.
Innovation Solution
A monolithic, multi-mode, CMOS-compatible imager with active, per-pixel drive and sense circuitry for transducers, allowing for simultaneous or time-multiplexed operation across ultrasonic, electrical, optical, and thermal domains, eliminating the need for mechanical scanners and reducing registration errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple imaging modalities are implemented using separate chips or products, then each modality can be optimized independently, but registration errors occur among different modalities and mechanical translation/rotation is required to switch between imagers
Solution Approach 1:
The patent combines multiple imaging modalities (optical, ultrasonic, electrical, thermal) into a single monolithic CMOS imager chip. Each pixel contains integrated transducers and circuitry for multiple modalities, eliminating the need for separate chips and mechanical switching. This merging approach achieves sub-micron registration accuracy while reducing system complexity.
Solution Approach 2:
The patent implements a universal pixel design where each pixel can perform multiple imaging functions (optical detection, ultrasonic transmission/reception, electrical sensing, thermal sensing) through integrated transducers. This multi-functionality allows simultaneous multi-modal imaging from the same location without requiring mechanical translation or rotation between separate imagers.
2Measurement precision
If mechanical translation or rotation is used to switch between different imagers, then data can be acquired from the same sample area, but high-resolution imaging is impeded by mechanical motion
Solution Approach 1:
The patent merges multiple imaging modalities into a single fixed imager array, eliminating mechanical translation or rotation mechanisms. Each pixel remains stationary while providing multiple imaging capabilities, thereby achieving high-resolution imaging without mechanical motion interference.
Solution Approach 2:
The patent replaces mechanical switching systems with an integrated electronic system where multiple transducers at each pixel can be electronically activated or deactivated. This substitution eliminates mechanical motion while maintaining the ability to switch between imaging modalities, preserving imaging resolution.
3Productivity
If sequential imaging is used to prevent simultaneous data acquisition, then data from different modalities can be collected, but fast simultaneous data acquisition is prevented
Solution Approach 1:
The patent merges multiple imaging modalities into a single pixel array where all modalities can operate simultaneously. Each pixel contains integrated transducers for optical, ultrasonic, electrical, and thermal sensing that can be activated concurrently, enabling fast simultaneous data acquisition without sequential delays.
Solution Approach 2:
The patent implements dynamic control of transducer activation where different modalities can be selectively enabled or disabled based on imaging requirements. This dynamic switching allows flexible operation modes including simultaneous multi-modal imaging, optimizing data acquisition speed while reducing imaging time.
4Measurement precision
If different chips are dedicated to different imaging domains, then each chip can be optimized for its specific modality, but simultaneous sensing from multiple domains and equidistant positioning cannot be achieved
Solution Approach 1:
The patent merges multiple imaging domains into a single monolithic CMOS chip with integrated transducers for optical, ultrasonic, electrical, and thermal sensing. This unified structure ensures all modalities are equidistant from the sample and provides uniform sensing characteristics, eliminating non-uniformities from cross-domain imaging while maintaining modality-specific optimization through dedicated circuitry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables high-resolution, simultaneous multi-modal imaging with reduced costs and complexity, achieving sub-micron registration between multiple modalities and supporting high-frame-rate data acquisition.
Implementation Method 1
pixels comprise one or more transducers in one or more of the ultrasonic, electrical, optical, and thermal domains
Implementation Method 2
optical transducer consists of one or more of a photodetector element using a semiconductor junction
Implementation Method 3
thermal transducers on the pixel consist of a temperature sensor and a local heater element
Data Source
AI summary
A single-chip solution for multi-modal imaging with every pixel capable of electrostatic, ultrasonic and optical imaging. The device can be configured in as much modality configurations as possible based on the types of the transducers included in the system.