Monolithic Cold Plate for Multiple Semiconductor Chip Packages
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Solution Overview
Problem
In high-performance computing environments, the integration of liquid cooling systems for multiple semiconductor chip packages is hindered by inefficiencies in the installation and removal of cold plates and tubing, which require significant time and effort, especially as the number of packages increases.
Innovation Solution
A universal monolithic cold plate design that couples to multiple chip packages simultaneously, featuring finned fluidic channels and a release mechanism that reduces the number of tubing installations/removals and minimizes the peeling force required, utilizing a pivot axis and cam mechanism to facilitate easy removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If individual cold plates are installed on each chip package, then thermal management effectiveness is improved, but installation time and complexity increase significantly
Solution Approach 1:
The patent combines multiple individual cold plate functions into a single monolithic cold plate structure that can be installed once to cool multiple chip packages simultaneously. This eliminates the need to install separate cold plates on each package, reducing installation time while maintaining effective thermal management across all chips.
Solution Approach 2:
The monolithic cold plate is designed as a universal cooling structure that can accommodate and cool multiple different chip packages through its integrated channel system. The single structure performs the function of multiple individual cold plates, providing multi-functionality without requiring multiple separate installations.
2Temperature
If multiple tubing connections are made for each cold plate, then cooling coverage is improved, but assembly complexity and time increase
Solution Approach 1:
The patent merges multiple tubing connection requirements into a single integrated connection system. The monolithic cold plate uses one set of tubing connections to deliver coolant to all chip packages simultaneously, eliminating the need for multiple separate tubing installations and significantly reducing assembly complexity.
Solution Approach 2:
The internal channel system of the monolithic cold plate is segmented into multiple regions that distribute coolant to different chip packages. This internal segmentation allows comprehensive cooling coverage without requiring external segmentation through multiple tubing connections, simplifying the overall assembly.
3Device complexity
If cold plate weight is concentrated on chip packages, then structural simplicity is improved, but damage risk to packages increases
Solution Approach 1:
The patent introduces support structures that act as counterweights to distribute the cold plate's weight away from the chip packages. These supports bear the majority of the cold plate's weight, reducing the peeling force and mechanical stress on the packages while maintaining the overall structural simplicity of the system.
4Ease of operation
If removal force is applied directly to chip packages, then ease of removal is improved, but package integrity is compromised
Solution Approach 1:
The support structures serve as mechanical advantages that reduce the force required for removal. By distributing the load and providing leverage points, the supports enable easy removal of the monolithic cold plate without applying excessive peeling force that could damage the chip packages or their underlying substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces the time and effort needed for cooling system assembly and disassembly, enhances thermal transfer efficiency, and distributes the weight of the cold plate to minimize the peeling force required, thereby improving operational efficiency and thermal management.
Implementation Method 1
heat dissipated by the chip(s) transfer through the lid of the package 102 and thermal interface material 103 into the cold plate 104
Implementation Method 2
As the fluid flows through the channels it absorbs heat from the cold plate 104
Data Source
AI summary
An apparatus is described. The apparatus includes a cold plate. The cold plate includes an input port to receive cooled fluid. The cold plate includes an ingress manifold to feed the cooled fluid to different regions, where, each of the different regions are to be located above its own respective semiconductor chip package. The cold plate includes an egress manifold to collect warmed fluid from the different regions. The cold plate includes an output port to emit the warmed fluid from the cold plate.