Monolithic Copper-Silica Substrate for Thermal Management
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Solution Overview
Problem
Conventional substrates for electronic components face challenges in achieving both electrical insulation and thermal conductivity due to the inherent properties of materials, often requiring complex multi-layer designs that can lead to delamination and increased production costs.
Innovation Solution
A monolithic substrate is created by sintering and fusing copper with a silica-based inorganic material, forming a thermally conductive surface and an electrically resistive surface, using a method that involves arranging copper and silica nanoparticles in a die mold and applying heat and pressure to bond them effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional multi-layer substrates are used to achieve both electrical insulation and thermal conductivity, then electrical insulation is improved, but structural stability deteriorates due to delamination risks
Solution Approach 1:
The patent merges the electrical insulation function and thermal conductivity function into a single monolithic substrate layer, eliminating the multi-layer structure that causes delamination. The substrate simultaneously provides electrical insulation through its material composition while maintaining thermal conductivity through direct contact with copper heat sinks, resolving the contradiction between reliability and structural stability.
Solution Approach 2:
The patent uses composite materials consisting of electrically insulating ceramic particles dispersed in a polymer matrix to achieve both electrical insulation and thermal conductivity in a single layer. This composite structure eliminates delamination risks while maintaining the required electrical and thermal properties.
2Reliability
If conventional multi-layer substrates are used to achieve both electrical insulation and thermal conductivity, then electrical insulation is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple functional layers into a single monolithic substrate that provides both electrical insulation and thermal management in one component, significantly reducing device complexity while maintaining electrical insulation reliability.
Solution Approach 2:
The monolithic substrate serves multiple functions simultaneously: electrical insulation, thermal conduction interface, and mechanical support structure, eliminating the need for separate layers and reducing overall device complexity.
3Reliability
If conventional multi-layer substrates are used to achieve both electrical insulation and thermal conductivity, then electrical insulation is improved, but manufacturing cost increases
Solution Approach 1:
The patent reduces manufacturing cost by consolidating multiple layers into a single monolithic substrate that can be produced in one manufacturing process, eliminating the need for separate layer fabrication and assembly steps while maintaining electrical insulation quality.
Solution Approach 2:
The patent changes the material parameters by using ceramic-polymer composite formulations that inherently provide both electrical insulation and thermal conductivity, eliminating the need for complex multi-layer constructions and reducing manufacturing costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting substrate provides superior thermal conductivity while preventing electrical shorting, offering a cost-effective and durable solution for mounting electronic components without the risks of delamination associated with multi-layer designs.
Implementation Method 1
heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, a pressure, and a time sufficient to sinter and fuse the base mixture with the secondary mixture
Data Source
AI summary
A monolithic substrate including a silica material fused to bulk copper is provided for coupling with electronic components, along with methods for making the same. The method includes arranging a base mixture in a die mold. The base mixture includes a bottom portion with copper micron powder and an upper portion with copper nanoparticles. The method includes arranging a secondary mixture on the upper portion of the base mixture. The secondary mixture includes a bottom portion with silica-coated copper nanoparticles and an upper portion with silica nanoparticles. The method includes heating and compressing the base mixture and the secondary mixture in the die mold at a temperature, pressure, and time sufficient to sinter and fuse the base mixture with the secondary mixture to form a monolithic substrate. The resulting monolithic substrate defines a first major surface providing thermal conductivity, and a second major surface providing an electrically resistive surface.