Monolithic Conductive Cylinder Through-Die Interconnect Bonding
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Solution Overview
Problem
Conventional semiconductor dies face issues with ineffective bonding due to underfilling or overfilling of conductive cylinders, leading to concave or convex protrusions that cause bonding failures and die separation, exacerbated by stress and pressure during cooling and solidification.
Innovation Solution
The implementation of monolithic conductive cylinders that extend through multiple semiconductor dies, formed in a single manufacturing step after bonding, eliminating the need for additional conductive material to connect adjacent dies and distributing stress along the cylinder's length.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive cylinders are used in semiconductor dies, then electrical interconnection between dies is achieved, but bonding effectiveness deteriorates due to underfilling or overfilling causing concave or convex protrusions
Solution Approach 1:
The patent merges the conductive cylinders from multiple dies into a single continuous monolithic conductive structure that extends through the entire stacked assembly. This eliminates the need for separate conductive cylinders in each die and removes the bonding interfaces between them, thereby eliminating the concave/convex protrusion problems and ensuring reliable bonding throughout the stack.
Solution Approach 2:
The invention segments the formation process into two distinct phases: first, bonding multiple dies together with their conductive cylinders in initial positions; second, forming a single continuous monolithic conductive structure that integrates all individual cylinders. This segmentation allows the dies to be bonded separately while the conductive structure is formed as one unified piece, resolving the fill accuracy problem.
2Volume of stationary object
If bond line thickness is reduced to decrease assembly volume, then device compactness is improved, but bonding reliability deteriorates due to stress and pressure during cooling and solidification
Solution Approach 1:
By merging all conductive cylinders into one monolithic structure, the patent eliminates multiple bonding interfaces between individual cylinders in stacked dies. This single continuous structure distributes thermal and mechanical stress uniformly along its entire length, preventing bonding failures that would occur at multiple discrete interfaces under reduced bond line thickness conditions.
Data Source
AI summary
A semiconductor device having monolithic conductive cylinders, and associated systems and methods, are disclosed herein. The semiconductor device can include a semiconductor substrate, a conductive pad, an opening, and a top dielectric layer. The conductive pad may be at a first surface of the semiconductor substrate. The opening may be ring-shaped and extend through the semiconductor substrate from the conductive pad to a second surface and define a side wall. The liner may coat the side wall and the top dielectric layer may cover the second surface and may fill the opening. A second ring-shaped opening may be formed through the semiconductor device and the opening and a conductive material plated therein.