Monolithic Semiconductor Diagnostic Sensor for USB Integration
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Solution Overview
Problem
Existing diagnostic technologies face challenges in providing a portable, easy-to-use device for small volume samples in droplet form, especially for rapid assay development and versatile detection methods for analytes like beads, DNA, RNA, and proteins, with a need for increased accuracy and versatility.
Innovation Solution
A monolithic semiconductor diagnostic sensor device with a distal end configured for non-proprietary data and power transfer, featuring exposed pads for sensor engagement, capacitive sensors, and a sensing circuit, manufactured using CMOS processing without downstream handling, and optionally with a hydrophobic polyimide layer for analyte retention, capable of fitting into USB or FFC sockets for direct use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If conventional diagnostic devices are used, then detection capability is provided, but device complexity and ease of operation are worsened due to multiple handling steps and proprietary interfaces
Solution Approach 1:
The patent combines the sensor, sensing circuit, connectors, and housing into a single monolithic integrated circuit device. This merging eliminates the need for separate handling of multiple components and reduces the number of assembly steps, directly improving ease of operation while maintaining detection capability.
Solution Approach 2:
The device incorporates multiple connection types (USB Type-C, FFC, and other non-proprietary interfaces) within a single monolithic structure. This universal design allows the same device to interface with various systems without requiring different handling procedures, enhancing ease of operation across different applications.
2Ease of manufacture
If monolithic semiconductor fabrication is used, then manufacturing steps are reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes standard CMOS fabrication parameters and processes that are well-established in the semiconductor industry. By operating within conventional parameter ranges rather than pushing to extreme precision limits, the monolithic fabrication achieves simplicity without sacrificing manufacturability. The design accommodates standard fabrication tolerances while integrating multiple functions.
3Adaptability or versatility
If multiple connection methods are provided, then versatility is improved, but device complexity increases
Solution Approach 1:
The monolithic integrated circuit incorporates multiple connector types (USB Type-C, FFC, and other non-proprietary interfaces) directly into the semiconductor substrate. This universal design allows the same device to interface with various systems without requiring different handling procedures, enhancing versatility while maintaining a simple single-chip architecture.
4Ease of manufacture
If downstream handling is eliminated, then ease of manufacture is improved, but risk of damage during fabrication increases
Solution Approach 1:
The patent designs the monolithic device with inherent mechanical robustness and protective structures that cushion against fabrication stresses. The integrated architecture eliminates fragile intermediate handling steps, and the device includes built-in protection mechanisms that prevent damage during the dicing and packaging processes, maintaining reliability while simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables rapid, accurate, and versatile detection and quantification of analytes with minimal processing steps, immediate readiness for use, and reduced risk of damage or error, facilitating rapid assay development and multiple connection methods.
Implementation Method 1
The circuit may comprise capacitive sensors
Implementation Method 2
the device may comprise a layer of hydrophobic material which is etched to form an exposed sensing region for each sensor. Preferably, the hydrophobic material comprises polyimide
Data Source
AI summary
A diagnostic sensor device has a semiconductor chip having a distal end physically configured to fit into a power and data socket conforming to a non-proprietary standard, and having exposed pads for engagement with corresponding conductors of such a socket. At its proximal end the chip has at least one sensor for contact with an analyte. The device may be manufactured in a single integrated process to provide a wafer which is diced to provide the individual devices.