Monolithic ECU Housing and Heat Sink for Compact Steering Cooling
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Solution Overview
Problem
The existing electric power steering systems face challenges in manufacturing compact assemblies with optimal heat dissipation, as traditional methods like welding or screwing of heat sinks with motor housings are cumbersome and inefficient, leading to suboptimal heat conduction and increased manufacturing costs.
Innovation Solution
A monolithic design where the housing and heat sink are manufactured as a single piece from the same material, allowing for improved heat conduction directly from printed circuit boards to the housing, which can then dissipate heat efficiently through a larger surface area, eliminating the need for separate components and connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional methods like welding or screwing are used to connect heat sink with motor housing, then heat dissipation can be achieved, but the manufacturing process becomes cumbersome and complex
Solution Approach 1:
The patent combines the heat sink and motor housing into a single monolithic component, eliminating the need for separate connection processes like welding or screwing. This merging of functions resolves the technical contradiction by achieving heat dissipation through the integrated structure while dramatically simplifying manufacturing to a single molding process.
Solution Approach 2:
The motor housing is designed to serve multiple functions simultaneously: it provides structural support for the motor, acts as a heat sink for thermal management, and serves as the housing for the entire assembly. This multi-functionality resolves the contradiction by achieving heat dissipation without requiring separate dedicated heat sink components or connection processes.
2Temperature
If heat sink is connected by welding or screwing, then heat conduction is achieved, but manufacturing time and costs increase
Solution Approach 1:
By merging the heat sink functionality into the motor housing itself, the patent eliminates multiple manufacturing steps (welding or screwing operations) and replaces them with a single molding process. This resolves the contradiction by maintaining effective heat conduction through the integrated design while significantly improving manufacturing efficiency and reducing production time.
3Temperature
If separate heat sink and housing components are used, then heat dissipation can be provided, but the assembly occupies more space and is harder to manufacture
Solution Approach 1:
The patent merges the heat sink and housing into a single monolithic component, which resolves the technical contradiction by achieving heat dissipation through the integrated structure while reducing assembly complexity to zero connection steps and minimizing the overall space required for component assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances manufacturability, reduces costs, and improves heat dissipation efficiency, allowing for better packaging of components and reduced risk of overheating in electronic control units for electric power steering systems.
Implementation Method 1
The heat sink is designed monolithically with the housing such that the heat sink is configured to conduct heat generated by the at least one printed circuit board to the housing
Implementation Method 2
the housing can then dissipate heat efficiently through a larger surface area
Data Source
AI summary
An electronic control unit for a vehicle is provided, with a housing, a heat sink and at least one printed circuit board. The housing is configured to be provided with an electric unit to be electrically connected to the at least one printed circuit board. The at least one printed circuit board is in close vicinity to at least one heat conduction surface of the heat sink. The heat sink is designed monolithically with the housing such that the heat sink is configured to conduct heat generated by the at least one printed circuit board to the housing.