Monolithic Encapsulant Packaging for Single-Step Double-Side Molding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing double-side molding technique for semiconductor device packages requires two separate molding operations, increasing manufacturing time and cost.
Innovation Solution
A semiconductor device package with a monolithic encapsulant that covers both surfaces of the substrate and extends within openings, allowing for a single molding process to form the package body on both sides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If two separate molding operations are used to form package bodies on both upper and lower surfaces, then the substrate is adequately protected, but the manufacturing time and cost increase
Solution Approach 1:
The patent merges two separate molding operations into a single molding process by forming a monolithic encapsulant that simultaneously provides protection for both the upper and lower surfaces of the substrate. The encapsulant is formed as one integrated piece that covers electronic components on both sides, eliminating the need for sequential molding operations and reducing manufacturing time while maintaining adequate protection.
Solution Approach 2:
The monolithic encapsulant serves multiple functions simultaneously: it protects electronic components on the upper surface, protects electronic components on the lower surface, and provides structural support for the entire package. This multi-functional design replaces what would traditionally require separate protective structures formed through multiple molding operations.
2Reliability
If two separate molding operations are used to form package bodies on both upper and lower surfaces, then adequate protection is provided, but manufacturing cost increases
Solution Approach 1:
The patent combines two separate molding operations into a single molding process that forms one integrated encapsulant structure. This consolidation reduces manufacturing cost by eliminating the need for two separate molding cycles, reducing material handling, and simplifying the manufacturing workflow while still providing comprehensive protection for electronic components on both surfaces.
3Productivity
If a monolithic encapsulant is used to cover both surfaces in a single process, then manufacturing time and cost are reduced, but the structural complexity increases
Solution Approach 1:
The monolithic encapsulant is designed with internal segmentation that allows it to accommodate electronic components on both upper and lower surfaces independently. The encapsulant contains distinct regions or cavities that can be separately configured for different components, allowing complex multi-sided packaging to be achieved through a single molding process without requiring the encapsulant itself to be overly complex.
Data Source
AI summary
A semiconductor device package includes a substrate and a monolithic encapsulant. The substrate has a first surface, a second surface opposite to the first surface and a plurality of lateral surfaces extending between the first surface and the second surface. The substrate defines a first opening and a second opening that extend between the first surface and the second surface and respectively expose the plurality of lateral surfaces. The monolithic encapsulant includes a first portion disposed on the first surface of the substrate, a second portion disposed on the second surface of the substrate and a third portion disposed within the first opening and the second opening.