Monolithic Fiber Attachment Structure with Segmented Adhesive Joints
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Solution Overview
Problem
Conventional methods for securing optical fibers to semiconductor laser diodes are costly, time-consuming, and prone to misalignment, often requiring multiple mounting structures and fragile solder joints that weaken the fiber and increase manufacturing complexity.
Innovation Solution
A monolithic platform with separate adhesive joints securely mounts the laser chip and optical fiber, using a threshold quantity of adhesive material for optical alignment and a greater quantity for mechanical support, reducing the need for additional sub-mounts and simplifying the alignment process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional methods using glass solder or permanent laser-welded fiber attachment are used, then mechanical strength is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent divides the fiber attachment structure into multiple segments: a first adhesive joint for optical alignment and a second adhesive joint for mechanical support. This segmentation allows each adhesive joint to perform its specific function optimally, eliminating the need for complex soldering or laser welding processes while maintaining both alignment precision and mechanical strength.
Solution Approach 2:
The patent changes the material parameter from traditional solder or laser-welded connections to adhesive materials. By selecting adhesive materials with appropriate properties and applying them in controlled quantities at specific locations, the patent achieves both optical alignment and mechanical strength without the complexity of conventional methods.
2Reliability
If multiple mounting structures are used to secure the optical fiber, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent merges the functions of multiple mounting structures into a simplified configuration. The first adhesive joint at the fiber tip provides both initial positioning and optical alignment, while the second adhesive joint provides mechanical support. This merged approach reduces the number of separate components while maintaining reliability.
Solution Approach 2:
The patent introduces adhesive material as an intermediary substance between the fiber and the mounting structure. This intermediary allows for reliable attachment while simplifying the overall structure, eliminating the need for multiple separate mounting components and complex assembly procedures.
3Manufacturing precision
If precise alignment is achieved using micro-positioning stages, then optical coupling efficiency is improved, but manufacturing time increases
Solution Approach 1:
The patent applies adhesive material to the fiber tip before final positioning, allowing the fiber to be held in place during alignment. This preliminary action eliminates the need for time-consuming micro-positioning stage adjustments while maintaining alignment precision, as the adhesive provides stable positioning throughout the alignment process.
Solution Approach 2:
The adhesive material serves multiple functions simultaneously: it provides mechanical support, maintains alignment, and secures the fiber in position. This self-service approach eliminates the need for separate alignment mechanisms and reduces manufacturing time while maintaining precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances optical coupling efficiency, improves reliability and repeatability of alignment, reduces component count, and minimizes manufacturing costs by integrating the laser chip and optical fiber on a single platform with fewer components and a simpler alignment process.
Implementation Method 1
a first adhesive joint including a first quantity of adhesive material attaching the optical fiber to the first island at a position at which a tip of the optical fiber is aligned with an output facet of the laser chip
Data Source
AI summary
A fiber attachment structure may comprise a monolithic platform structure having a first trench and a second trench to segment the monolithic platform structure into a chip mount area, a first island, and a second island. A laser chip may be mounted directly on the chip mount area and an optical fiber may be mounted on the first island by a first adhesive joint and on the second island by a second adhesive joint. For example, in some implementations, the first adhesive joint may include a first quantity of adhesive material attaching the optical fiber to the first island at a position at which a tip of the optical fiber is aligned with an output facet of the laser chip, and the second adhesive joint may include a second quantity of the adhesive material to mechanically secure the optical fiber to the second island.